Photosensitive Chip Package Structure With Glue Groove Wire Clearance
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Solution Overview
Problem
The miniaturization of camera modules is hindered by the need for space on the circuit board for bonding the package cover and the overflow of glue during bonding, which increases the size of the camera module and is not conducive to miniaturization design.
Innovation Solution
A photosensitive chip package structure that includes a substrate, a photosensitive chip, and a frame with an avoidance groove on the frame to accommodate the metal wire, allowing the filling glue to wrap around it and bond the frame to the substrate and non-photosensitive area, eliminating the need for a sidewall on the substrate and reducing the module's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a sidewall is added to the package cover for bonding, then the package cover can be securely bonded to the circuit board, but the size of the circuit board must be increased to accommodate the sidewall and reserve safe distance from surface-mount devices
Solution Approach 1:
The patent replaces the rigid sidewall structure with a flexible bonding approach using filling glue that flows into the avoidance groove and bonds the frame directly to the circuit board substrate. This eliminates the need for additional sidewall space while maintaining bonding strength through the adhesive material.
Solution Approach 2:
The patent transitions from a two-dimensional sidewall bonding approach to a three-dimensional bonding solution by using filling glue that can flow and conform to the avoidance groove geometry, bonding the frame to the substrate in the vertical dimension rather than requiring horizontal extension of the sidewall.
2Reliability
If space is reserved on the circuit board for the sidewall and safe distance from surface-mount devices, then bonding can be performed without affecting other components, but the overall camera module size increases
Solution Approach 1:
The patent extracts the bonding function from the sidewall structure and relocates it to the filling glue material that flows into the avoidance groove. This separates the bonding function from the structural support function, allowing the frame to be bonded directly to the substrate without requiring additional space for a sidewall.
Solution Approach 2:
The filling glue serves multiple functions: it fills the avoidance groove to protect the metal wire, bonds the frame to the substrate, and provides structural support. This multi-functionality eliminates the need for separate sidewall structures and reduces the overall camera module volume.
3Strength
If glue is dispensed at the bottom of the sidewall during bonding, then the package cover can be bonded to the circuit board, but glue overflow may affect surface-mount devices on the circuit board
Solution Approach 1:
The patent converts the potential harm of glue overflow by providing a designated path for the glue through the avoidance groove. The filling glue is intended to flow into this groove, and any overflow is directed away from surface-mount devices, transforming a potential defect into a controlled bonding process.
Solution Approach 2:
The avoidance groove acts as an intermediary structure that guides the filling glue during the bonding process. It serves as a channel that directs the glue flow, preventing uncontrolled overflow onto the circuit board and protecting surface-mount devices from glue contamination.
4Ease of manufacture
If the frame is bonded using traditional sidewall methods, then bonding can be performed, but the process requires additional space and increases manufacturing complexity
Solution Approach 1:
The patent merges the avoidance groove structure with the bonding process by designing the groove to serve as both a protective feature for the metal wire and a bonding channel for the filling glue. This integration eliminates the need for separate sidewall structures and simplifies the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces the size of the camera module, improves the filling effect of the glue, prevents air bubble generation, and enhances the structural stability of the package structure, facilitating miniaturization and ultra-thin design in mobile terminals.
Implementation Method 1
The avoidance groove is filled with filling glue inside. When the filling glue is disposed, on one hand, the filling glue can wrap around the metal wire, so that the metal wire is protected. On the other hand, the filling glue can be used to bond the frame to the substrate and the non-photosensitive area of the photosensitive chip
Data Source
AI summary
A terminal includes a substrate and a photosensitive chip mounted on the substrate, where a side of the photosensitive chip away from the substrate has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive chip is electrically connected to the substrate by using a metal wire; and the photosensitive chip package structure further includes: a frame, disposed on the side of the photosensitive chip away from the substrate, where an avoidance groove used to avoid the metal wire is disposed on a side of the frame facing the substrate, the avoidance groove extends along a side edge of the frame, and an inner wall of the avoidance groove is an arc-shaped inner wall; and a filling glue, filled in the avoidance groove, and used to wrap the metal wire and bond the frame to the non-photosensitive area of the photosensitive chip and the substrate.