Mortise-Tenon Chip Package Structure for Moisture and Light Shielding
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Solution Overview
Problem
Existing chip packaging technologies suffer from low tolerance to real-world environments due to moisture absorption leading to cracks and false sensing from inadequate lateral shielding, especially in optical sensing chips.
Innovation Solution
A chip package structure utilizing mortise-tenon joint structures between the conductive substrate, molding layer, and package cover to seal adhesives, reducing exposure to air and providing better protection against lateral light sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy resin is used to adhere substrate to glass cover, then adhesion is achieved, but moisture absorption leads to cracks during reflow process
Solution Approach 1:
The patent extracts the adhesive from direct exposure to the external environment by introducing a sealing structure (molding compound or sealing adhesive) that isolates the adhesive between the substrate and cover glass. This prevents moisture ingress while maintaining the adhesive's bonding function, thereby resolving the contradiction between adhesion strength and crack resistance.
Solution Approach 2:
The patent introduces a sealing structure (molding compound or sealing adhesive) as an intermediary element between the adhesive and the external environment. This intermediary prevents moisture from reaching the adhesive, allowing the adhesive to maintain its strength without suffering from moisture-induced cracking.
2Ease of manufacture
If epoxy resin is exposed to air for adhesion, then bonding is achieved, but moisture soaking causes large amount of moisture absorption and cracks
Solution Approach 1:
The patent extracts the adhesive from direct contact with moisture by enclosing it within a sealed structure formed by the molding compound or sealing adhesive. This allows the adhesive to perform its bonding function during manufacturing while preventing moisture absorption during subsequent storage and operation.
Solution Approach 2:
The patent applies preliminary protective action by forming a sealing structure (molding compound or sealing adhesive) that prevents moisture from reaching the adhesive before moisture soaking occurs. This preemptive sealing eliminates the harmful effect of moisture absorption while maintaining ease of manufacture.
3Adaptability or versatility
If epoxy resin is used as side wall for optical sensing chip, then packaging is achieved, but lateral shielding is insufficient causing false sensing
Solution Approach 1:
The patent applies local quality by making the molding compound or package cover opaque or light-absorbing in the regions that provide lateral shielding, while maintaining transparency where light transmission is needed for chip operation. This localized property differentiation enables both packaging functionality and lateral light blocking.
Solution Approach 2:
The patent uses composite materials (molding compound or package cover with specific optical properties) that combine structural support functionality with light-blocking properties. This composite approach allows the same component to provide both packaging and lateral shielding functions, eliminating false sensing while maintaining versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces cracks in adhesives and prevents lateral light interference, enhancing the package's durability and functionality during pre-conditioning tests while saving packaging costs.
Implementation Method 1
The molding layer is disposed on the first board surface and surrounds the die-bonding region and the chip... At least two of the conductive substrate, the molding layer and the package cover are connected to each other through at least one mortise-tenon joint structure
Implementation Method 2
At least two of the conductive substrate, the molding layer and the package cover are connected to each other through at least one mortise-tenon joint structure
Implementation Method 3
In such tests, the packaged chip products absorb moisture in the moisture soaking step, and the absorbed moisture will rapidly expand due to a rapid increase in temperature during the reflow test
Implementation Method 4
the absorbed moisture will rapidly expand due to a rapid increase in temperature during the reflow test
Data Source
AI summary
A chip package structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a chip, a molding layer and a package cover. The conductive substrate has first and second board surfaces opposite to each other, and a die-bonding region is defined on the first board surface. The chip is disposed on the first board and located in the die-bonding region, and is electrically connected to the conductive substrate. The molding layer is disposed on the first board surface and surrounds the die-bonding region and the chip. The package cover is disposed on the molding layer, and the package cover, the molding layer and the conductive substrate jointly define an enclosed space surrounding the chip. Two of the conductive substrate, the molding layer and the package cover are connected to each other through a mortise-tenon joint structure.