Chip Package Light Shielding Layer and Conducting Bump
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Solution Overview
Problem
Optoelectronic devices face challenges in achieving precise light sensing and emitting due to external light interference, which affects their performance in applications such as digital cameras and solar cells, where existing packaging solutions fail to effectively shield or manage light.
Innovation Solution
A chip package design featuring a substrate with an optoelectronic device, a protection layer, a light shielding layer that extends into the protection layer's opening, and a conducting bump, where the light shielding layer and conducting bump work together to block external light, enhancing the precision of light sensing and emitting devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional packaging structure is used, then the device structure is simple, but external light interference cannot be effectively blocked, reducing light sensing precision
Solution Approach 1:
The packaging structure is segmented into multiple functional layers: a protection layer with an opening, a light shielding layer with a light blocking portion extending into the opening, and a conducting bump filled in the opening. This segmentation allows each layer to perform its specific function (protection, light blocking, electrical connection) independently, achieving effective light interference blocking while maintaining structural organization
Solution Approach 2:
The light shielding layer acts as an intermediary element between the protection layer and the substrate. Its light blocking portion extends into the opening of the protection layer, serving as a mediator that specifically addresses the light interference problem without requiring complete redesign of the entire packaging structure
2Object-affected harmful factors
If the light shielding layer extends into the protection layer opening, then light blocking effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The light blocking portion of the light shielding layer and the conducting bump are merged in space by filling the conducting bump material into the same opening where the light shielding layer extends. This merging allows simultaneous achievement of light blocking and electrical connection functions through a integrated structure, simplifying the manufacturing process compared to creating separate structures for each function
Solution Approach 2:
The opening in the protection layer serves multiple purposes: it allows the light shielding layer to extend inward for light blocking, and simultaneously provides a cavity for the conducting bump to be filled in for electrical connection. This multi-functionality of the opening structure reduces the need for additional separate features, easing manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively blocks external light, improving the precision of optoelectronic devices by combining the light shielding layer and conducting bump within the chip package, thereby enhancing their operational performance.
Implementation Method 1
a light shielding layer located on the second surface of the substrate, wherein a portion of the light shielding layer extends into the opening of the protection layer
Implementation Method 2
a conducting layer located between the substrate and the protection layer, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump
Data Source
AI summary
An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer located on the second surface of the substrate, wherein the protection layer has an opening; a light shielding layer located on the second surface of the substrate, wherein a portion of the light shielding layer extends into the opening of the protection layer; a conducting bump disposed on the second surface of the substrate and filled in the opening of the protection layer; and a conducting layer located between the substrate and the protection layer, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump.