Chip Package Positioning Structure for Reflow Tilt Control
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Solution Overview
Problem
Chip packages with detection elements cantilever-supported by a circuit board may tilt or displace during solder reflow, leading to variations in detection element characteristics.
Innovation Solution
A chip package positioning and fixing structure that includes a solder fixation portion and a positioning portion closer to the detection element, allowing for adjustment of the chip package's tilt and position relative to the circuit board, reducing mounting variations through the use of a convex positioning portion and resin sealing to maintain the detection element's exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a chip package is cantilever-supported by a circuit board, then the structure is simple and easy to manufacture, but the chip package may tilt or displace during solder reflow, causing variations in detection element characteristics
Solution Approach 1:
The positioning structure is divided into two distinct functional portions: a solder fixation portion for securing the chip package to the circuit board, and a positioning portion closer to the detection element for preventing tilt and displacement. This segmentation allows each portion to optimize its specific function, resolving the contradiction between simple manufacturing and precise mounting.
Solution Approach 2:
The positioning portion acts as an intermediary element between the chip package body and the circuit board, providing mechanical support and positioning functionality. This intermediary structure prevents direct cantilever support while maintaining manufacturing simplicity, thereby improving mounting precision without significantly complicating the manufacturing process.
2Manufacturing precision
If a positioning portion is added closer to the detection element, then mounting precision and tilt control are improved, but the device complexity increases
Solution Approach 1:
The positioning portion and solder fixation portion are merged into a single integrated structure that is formed as one piece with the circuit board. This merging approach improves mounting precision by providing dedicated positioning functionality while avoiding the complexity of separate positioning components, assembly steps, and additional fastening mechanisms.
Solution Approach 2:
The positioning portion serves multiple functions simultaneously: it provides mechanical positioning to prevent tilt, supports the chip package during solder reflow, and maintains the detection element's exposure. This multi-functionality reduces the need for additional specialized components, thereby improving precision without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the chip package's position and tilt during solder reflow, ensuring high mounting accuracy and reducing variations in the detection element's characteristics.
Implementation Method 1
a solder fixation portion that fixes the chip package to the circuit board by soldering
Data Source
AI summary
To obtain a chip package positioning structure capable of adjusting a tilt and a position of a chip package with respect to the circuit board and reducing mounting variations. The chip package positioning and fixing structure that positions and fixes, to a circuit board 4, a chip package 5 in which a flow rate detection element 53 is sealed with a resin so that a detection portion is at least exposed, in which the chip package includes a solder fixation portion 52 that fixes the chip package to the circuit board by soldering, and a positioning portion 514 that performs positioning to the circuit board, and the positioning portion is provided closer to the flow rate detection element from the solder fixation portion.