Printed Circuit Assembling TRIZ Cases

A single-substrate package embeds the chip and wiring in a molding layer, cutting thickness and avoiding stacked wiring boards.

Bracket protrusions let jigs place a slim PCB interface terminal precisely, improving mass assembly while preserving secure, waterproof connection.

Vertical stacking with a flexible printed wiring board preserves signal integrity while increasing PCB space efficiency for high-bandwidth links.

Alternating conductor planes, insulating layers, and shielding integrate power, signal, and data paths while limiting crosstalk and EMI.

A shoulder-and-fastener fixing structure secures connector modules on circuit boards without pressing plates or board holes, saving space and easing removal.

Decoupling capacitors placed between stacked patch antennas form a ground wall that cuts crosstalk and fixes substrate spacing for stable RF performance.

Controlling joining-layer hardness in a ceramic-copper bonded body helps relieve thermal stress and maintain TCT reliability at high temperature.

Decoupling capacitors placed between stacked patch antennas form a ground wall, cut crosstalk, and stabilize substrate gap.

An embedded organic bridge replaces silicon to avoid CTE mismatch, reducing delamination and cracking in high-density multi-chip packages.

Multiple sintered-metal through-hole segments disperse thermal stress and keep high-current interposer connections durable through thermal cycles.

A positioning portion placed near the flow detection element limits chip package tilt during solder reflow and reduces mounting variation.

A tin-gold alloy joined with bismuth regions enables low-temperature semiconductor bonding while suppressing cracking, melting, and insulation failure.

A PCB-patterned fuse and flame-retardant case suppress overvoltage while containing fuse-blow arcs away from breaker components.

Adjusted multilayer wiring density and adhesive filling suppress thin memory substrate warpage while preserving signal integrity.

A buckled elastic sheet on the loading mechanism cover protects CPU socket pins, blocks debris, and prevents cover interference during reassembly.

A single-sided PCB layout uses vias and strap contacts to cut copper etching, material waste, and battery pack assembly time.

An interposer with redistribution layers bridges pad pitch mismatches, cutting parasitic capacitance and resistance while simplifying assembly.

Different trace densities in stacked carrier layers enable compact component links without redistribution structures, easing manufacturing and heat constraints.

Press-fit pins welded, soldered, or brazed to power and signal leads improve substrate coupling reliability while avoiding co-planarity issues.

Taller ground pins around signal pins suppress impedance mismatch, reflection, passage loss, and crosstalk from DC to 70 GHz.

A tapered through-hole ground path cuts inductance in thick dielectric boards, preserving strength and stable GHz microstrip performance.

Adjusting terminal bent-part angles limits friction torque during assembly, preserving spacing and reducing impedance and crosstalk.

Offset lead tabs and top-bottom terminals cut parasitic inductance, improving high-speed decoupling in a smaller board footprint.

Spaced circuit members and a stacked circuit portion expand large-package layout area while improving yield and lowering fabrication cost.

Active tip rotation and optical feedback correct companion chip bowing during PIC assembly, maintaining waveguide alignment through adhesive curing.

A recessed PCB heat path lets a side-by-side TEC stabilize silicon photonics chip temperature with lower cooling power and smaller form factor.

A flexible PCB matrix of battery cells boosts wearable power capacity while limiting weight, stress, and environmental exposure.

Metal particle dispersion fills resist openings by needle transfer and sintering to form uniform fine-pitch bumps without seed-layer stripping.

A stepped female contact with a tubular via and larger conductive cup cuts VPX crosstalk at high data rates while easing drilling and plating.

Through-holes vent air and moisture during sidefill curing, preventing resin voids that can damage solder joints on mounting boards.

Grooves in the underfill fillet relieve thermal cycling stress in semiconductor packages, reducing cracking and delamination risk.

Direct cable welding replaces the subboard in a server expansion card to cut wiring loss, impedance discontinuities, crosstalk, and cost.

Embedded lateral connectors within PCB layers enable fast board coupling and electrical connection without adding thickness, weight, or bulk.

Nanowire contact surfaces are microstructured to raise resistance to a target value, avoiding solder heat stress while keeping a stable connection.

An elastic adhesive layer keeps wiring pressed onto exposed electrodes in a resin-embedded module, preventing disconnection during bending.

A reducing treatment and protective immersion form a removable nanowire coating that avoids chemical stripping, residues, and gas atmospheres.

A stepped stopper with effusion holes and a PCB-mounted holder vents electrolyte gas while preventing condenser separation during explosion.

Coplanar power-terminal heat exchange with a conductive plate and larger coolant channels improves cooling efficiency for high-power EV charging.

Standardized control regions and via-hole positions let one Mini LED wiring substrate support different microchips, reducing mask changes and development time.

An asymmetric coil-to-surface layout preserves magnetic flux space, keeping coil components compact without sacrificing inductance.

Forward-bias light or heat detection pinpoints failed substrate-bonded variable capacitors early, enabling repair and higher yield.

Stud bumps create an artificial QFN lead standoff that drives visible solder fillets for automated inspection and more reliable PWB attachment.

Fine solder particles and a high volatile medium form uniform bumps on sub-25 μm electrode gaps while suppressing bridging and dewetting.

Bonding the cap layer before substrate thinning supports FIR sensor via etching, reducing breakage and enabling compact T-shaped integration.

A spring-clip PCB retention arrangement keeps turbomachine e-machine controllers compact while handling thermal expansion, vibration, and isolation.

A dual-connector memory module expands server memory channels and capacity while preserving data processing speed through flexible board-to-board allocation.

A raised MOSFET gate pin isolates the control connection from copper plates, enabling stable high-current BMS PCB mounting in harsh environments.

Simultaneous assembly on arrayed metal bases uses sintered metal paste and resin frames to cut package assembly time and material cost.

A conductive pattern in the OLB dummy area links adjacent COFs, reducing driver parts, failure points, and display panel cost.