Dual-Connector Memory Module for Server Memory Channel Expansion
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Solution Overview
Problem
Server devices face challenges in efficiently processing increasing data capacities due to limitations in memory channel connectivity and memory module allocation, leading to reduced data processing speeds and insufficient memory capacity.
Innovation Solution
The implementation of a memory module with a main connector and auxiliary connector configuration, along with a main board design that includes processor sockets, memory module sockets, and extension connectors, allows for flexible allocation of memory channels and expansion of memory capacity using board-to-board connectors, optimizing data processing speed and capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory capacity is increased to handle larger data processing requirements, then the data processing capacity is improved, but the memory channel connectivity becomes insufficient and data processing speed decreases
Solution Approach 1:
The memory module is divided into two separate connectors: a main connector for primary memory channel connection and an auxiliary connector for additional memory channel connection. This segmentation allows the memory module to connect to multiple memory channels simultaneously, thereby increasing data processing speed while maintaining high memory capacity. The plurality of memory chips are distributed across both connectors, enabling parallel data access through multiple channels.
2Productivity
If memory module sockets are increased to provide more memory channels, then data processing speed is improved, but the board complexity and space requirements increase
Solution Approach 1:
The memory module with dual connectors (main connector and auxiliary connector) serves multiple functions: it can connect to a single memory channel through the main connector alone, or connect to multiple memory channels by utilizing both connectors. This multi-functionality allows the same memory module design to adapt to different board configurations and capacity requirements, reducing the need for multiple specialized socket types and simplifying board design.
3Quantity of substance
If memory chips are mounted on both surfaces of the memory substrate, then memory capacity is increased, but the manufacturing complexity and potential reliability issues increase
Solution Approach 1:
The patent utilizes the third dimension (both surfaces of the memory substrate) to mount memory chips, effectively doubling the available mounting area compared to single-sided mounting. This dimensional approach increases memory capacity without requiring a larger substrate area or more complex multi-layer stacking. The main connector and auxiliary connector are positioned to accommodate chips on both surfaces, making efficient use of the available space.
Data Source
AI summary
A memory module includes a memory substrate including a main connector and an auxiliary connector, configured to be connected to an external device; and a plurality of memory chips mounted on at least one of a first surface or a second surface of the memory substrate, wherein the main connector is disposed on one side of the memory substrate, and the auxiliary connector is disposed on the second surface of the memory substrate.