Stacked Component Carrier Layout for Dense Interconnect Reliability
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Solution Overview
Problem
The increasing miniaturization and complexity of component carriers with multiple electronic components pose challenges in efficiently managing heat removal and ensuring mechanical robustness and electrical reliability, particularly in connecting components effectively.
Innovation Solution
A component carrier design featuring stacked layers with varying densities of trace and connection structures, allowing for flexible integration densities and simplified manufacturing, while ensuring reliable electrical connectivity between components without the need for redistribution structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If components are miniaturized and densely packed to increase functionality, then the number of components and contacts increases, but heat removal becomes increasingly difficult and manufacturing complexity increases
Solution Approach 1:
The component carrier is divided into multiple stacks, each with its own insulating and conductive layer structures. This segmentation allows independent optimization of each stack's trace and connection structure densities, simplifying the manufacturing process while achieving high overall integration density through vertical stacking.
Solution Approach 2:
The patent transitions from planar 2D layout to 3D vertical stacking, allowing components and connection structures to be arranged in multiple layers. This dimensional change enables higher integration density without proportionally increasing manufacturing complexity, as each stack can be manufactured independently and then combined.
2Manufacturing precision
If trace and connection structures are densely packed to achieve high integration, then electrical connectivity improves, but manufacturing precision requirements increase significantly
Solution Approach 1:
Different stacks are designed with different trace and connection structure densities optimized for their specific functions. The first stack has a first density of trace structures and first density of connection structures, while the second stack has a second density of trace structures and second density of connection structures. This local optimization allows high connection reliability without uniformly high manufacturing precision requirements across the entire component carrier.
3Area of stationary object
If multiple components are connected with high density to reduce size, then area utilization improves, but heat management challenges increase
Solution Approach 1:
By arranging components and connection structures in vertical stacks rather than planar layouts, the patent achieves high integration density without proportionally increasing heat generation density. The vertical arrangement distributes heat sources across multiple layers, improving heat dissipation efficiency while maintaining compact footprint.
Data Source
AI summary
A component carrier includes a first stack with an electrically insulating layer structure and an electrically conductive layer structure with a first density of trace structures and a second density of first connection structures, a second stack with a second electrically insulating layer structure and a second electrically conductive layer structure with a third density of second trace structures and a fourth density of second connection structures. A first component is applied to the first stack and a second component is embedded in the second stack. The first connection structures are respectively connected to the second connection structures. The first density of first trace structures is lower than the third density of second trace structures. The first stack and the second stack are connected with each other by the first connection structures and by the second connection structures. The first component is connected to the second component.