Resin-Embedded Electronic Module for Bend-Stable Connections
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Solution Overview
Problem
Existing modules with electronic devices and connection members fail to maintain electric connections when bent, as the rigid microphone can become unstuck from the flexible base member, leading to potential disconnection of terminals and conductive patterns.
Innovation Solution
A module design featuring an electronic device embedded in a resin portion with exposed electrodes, a film-like base member, and a pressure-sensitive adhesive layer, where the resin portion directly adheres to the connection member, ensuring the wiring remains pressed on the electrodes even when the module is bent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a rigid electronic device is mounted on a flexible connection member, then the connection member can be bent, but the electronic device may become unstuck and electric connection may be cut
Solution Approach 1:
The electronic device is embedded within the resin portion, creating a nested structure where the device is protected and held securely. The resin portion acts as a protective shell that maintains the device's position on the flexible connection member during bending, preventing disconnection while preserving the flexibility of the overall structure.
Solution Approach 2:
The invention uses a composite structure combining the rigid electronic device, the flexible connection member, and the resin portion. This composite design allows the system to exhibit both flexibility from the connection member and structural stability from the resin-embedded device assembly, resolving the contradiction between adaptability and reliability.
2Ease of manufacture
If an adhesive layer is used to mount the electronic device, then the device can be attached to the connection member, but the adhesive may not maintain connection under bending stress
Solution Approach 1:
The resin portion is applied beforehand to embed the electronic device, creating a cushioning effect that protects the device and maintains its position. This pre-embedding approach provides mechanical support and stress distribution that simple adhesive mounting cannot achieve, ensuring reliable connection even under bending stress while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design maintains secure electric connections between the electrodes and wiring, even when the module is bent, by using an elastic adhesive layer that adheres to the resin portion and applies pressure to the electrodes, preventing disconnection.
Implementation Method 1
The adhesive layer 34 has elasticity and is elastically deformable. When the connection member 30 is stuck to the structural object 20, the adhesive layer 34 is elastically deformed... an elastic reaction force is caused in the adhesive layer 34. The elastic reaction force presses the wiring 36 on the electrode 224.
Data Source
AI summary
A module is provided with a structural object and a connection member. The structural object is provided with an electronic device and a resin portion. The electronic device has an electrode. The electronic device is embedded in the resin portion. The electrode is exposed from the resin portion. The connection member is provided with a film-like base member, an adhesive layer 34 provided on the film-like base member and a wiring formed on the adhesive layer at least in part. The connection member is stuck to the structural object. At least a part of the resin portion of the structural object is directly stuck to the adhesive layer of the connection member. The wiring is pressed to the electrode of the electronic device.