Terminal Angle Layout for High-Speed Electronic Module Signal Integrity

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Solution Overview

Problem

In electronic modules, the spacing between terminals changes during assembly, leading to poor signal integrity, especially at high speeds, due to the deviation of bent terminal parts under friction forces, resulting in distorted signals and increased impedance and crosstalk.

Innovation Solution

The electronic module design includes terminals with a body part and a first bent part, where the torque from the friction force is minimized by adjusting the angle between the bent part's extension direction and the sliding direction, ensuring the bent part does not rotate, maintaining consistent spacing and reducing impedance and crosstalk, with specific material choices like copper alloy and phosphor bronze, and optimized terminal arrangements to offset friction forces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the bent part of the terminal is designed with a conventional 45° angle, then the assembly process is simple, but the bent part deviates under friction force during sliding, changing the spacing between terminals and degrading signal integrity

Engineering Contradiction:
Improveassembly simplicityVSAvoidsignal integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the critical parameter of the bent part angle from the conventional 45° to a specific range (0°-15° or 75°-90°). This parameter modification ensures that the friction force during sliding acts along the extension direction of the bent part rather than causing deviation, thereby maintaining terminal spacing and signal integrity while still allowing for straightforward assembly processes

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the bent part angle is adjusted to minimize friction torque, then signal integrity is maintained, but the terminal structure becomes more complex

Engineering Contradiction:
Improvesignal integrityVSAvoidterminal structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Rather than adding complex mechanisms or structures, the patent achieves improved signal integrity by simply modifying the angular parameter of the existing bent part structure. The optimized angle range (0°-15° or 75°-90°) allows the terminal to maintain its spacing during assembly without requiring additional components or complex structural modifications

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design maintains good signal integrity at high speeds by preventing terminal part rotation and maintaining consistent spacing, reducing impedance and crosstalk, thereby enhancing the performance of electronic devices such as mobile phones and computers.

Implementation Method 1

Each terminal includes a body part and a first bent part connected to the body part; the first bent part presses against a corresponding first solder pad

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS12114418B2Electronic module and electronic device
Publication Date: 2024.10.08 HUAWEI TECH CO LTD
  • US12114418B2 patent drawing
  • US12114418B2 patent drawing
  • US12114418B2 patent drawing

AI summary

This application provides an electronic module and an electronic device. The electronic module includes a first component, a second component, and a plurality of terminals. The first component includes a package substrate and a chip mounted on the package substrate. The second component includes a circuit board and a mount base mounted on the circuit board. Each terminal includes a body part, and a first bent part and a solder ball that are respectively connected to two opposite ends of the body part. In each terminal, the body part passes through and is fastened to the mount base, the first bent part presses against a corresponding first solder pad on the package substrate, and the solder ball is connected to a corresponding second solder pad on the circuit board.