Press-Fit Power Module Assembly for Co-Planarity-Free Substrate Coupling
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Solution Overview
Problem
Existing semiconductor packages face challenges in securely coupling leads to substrates, particularly due to co-planarity issues and the need for reliable, high-performance connections that can withstand insertion and extraction forces, while also being repairable and cost-effective.
Innovation Solution
The use of press-fit pins made from alloys like CuCrAgFeTiSi, coupled to signal and power leads through welding, soldering, or brazing, which are designed to provide strong, reliable connections and allow for repair, using a jig for precise alignment and a leadframe made of high-purity copper for thermal and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leads are soldered to substrates to couple semiconductor packages, then electrical connection is established, but co-planarity issues and reliability under insertion/extraction forces deteriorate
Solution Approach 1:
The patent changes the connection method from soldering to press-fit mechanical insertion. The press-fit pins are inserted into recesses in the substrate, creating a mechanical interlock that eliminates co-planarity issues and provides superior reliability under insertion and extraction forces compared to traditional soldered connections.
Solution Approach 2:
The patent replaces the chemical bonding mechanism of soldering with a mechanical press-fit system. The press-fit pins create a physical interlock between the lead frame and substrate, providing both electrical connection and mechanical strength, thereby eliminating the co-planarity problems associated with soldered joints.
2Strength
If press-fit pins are used to couple leads to substrates, then connection strength and repairability improve, but manufacturing complexity increases
Solution Approach 1:
The patent segments the connection system into separate press-fit pins that are attached to individual leads or lead groups. This modular approach allows each pin to be independently positioned and pressed into the substrate, simplifying the manufacturing process while maintaining strong connections and enabling selective repair of individual pins if needed.
3Reliability
If press-fit pins are welded, soldered, or brazed to leads, then connection reliability improves, but manufacturing process complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-attaching the press-fit pins to the lead frame or individual leads before final assembly. The pins are secured to the leads using welding, soldering, or brazing in a preliminary manufacturing step, allowing the lead frame assembly to be prepared in advance. This preliminary attachment ensures reliable connections while enabling flexible manufacturing scheduling and reducing rush-order complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a strong, reliable, and repairable connection between semiconductor packages and substrates, reducing co-planarity problems and enabling efficient manufacturing with minimal equipment changes, while maintaining high thermal and electrical performance.
Implementation Method 1
The press fit pins may be coupled to the signal leads and the power leads through welding, soldering, or brazing.
Implementation Method 2
The press fit pins may be coupled to the signal leads and the power leads through welding, soldering, or brazing.
Implementation Method 3
The press fit pins may be coupled to the signal leads and the power leads through welding, soldering, or brazing.
Data Source
AI summary
Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.