Semiconductor Package Assembly Using Sintered Metal Paste
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Solution Overview
Problem
The existing assembly processes for semiconductor devices, particularly those using metal bases, ceramic frames, and ceramic lids, face high assembly costs despite offering cost merit in material reduction, and there is a need for a more efficient method to assemble multiple semiconductor devices simultaneously while reducing material and assembly costs.
Innovation Solution
A process involving the arraying of metal bases on a carrier, simultaneous application of sintered metal paste, and curing to form a semiconductor device with a metal base, side wall, and lid, where the sintered metal paste is used to attach and secure semiconductor chips and circuit components, reducing assembly time and material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal base, ceramic frame, and ceramic lid are used to form an RF device package, then structural integrity and hermetic sealing are improved, but manufacturing cost and assembly complexity increase
Solution Approach 1:
The patent changes the material parameter of the frame from ceramic to resin, and modifies the sealing mechanism from brazed joints to adhesive bonding. This parameter change reduces manufacturing cost while maintaining hermetic sealing through the adhesive layer between the resin frame and metal base, and between the resin frame and ceramic lid.
Solution Approach 2:
The patent employs composite material construction by combining resin frame with metal base and ceramic lid. The resin frame serves as a cost-effective structural component, while the metal base provides hermetic sealing at the bottom, and the ceramic lid provides hermetic sealing at the top. This composite approach balances cost reduction with maintained reliability.
2Manufacturing precision
If individual assembly of semiconductor devices is performed, then assembly precision is maintained, but productivity and manufacturing efficiency decrease
Solution Approach 1:
The patent merges multiple individual assembly operations into a single simultaneous assembly process. Multiple semiconductor chips are mounted on multiple metal bases at the same time, and multiple resin frames are attached to multiple metal bases simultaneously using a common adhesive application and curing process. This merging maintains assembly precision through standardized procedures while dramatically improving productivity.
Solution Approach 2:
The patent implements preliminary action by preparing multiple metal bases with mounted semiconductor chips before the frame attachment step. The adhesive is applied in advance to the metal bases, and then the resin frames are attached simultaneously to multiple prepared bases. This preliminary preparation enables efficient simultaneous assembly while maintaining precision through pre-arranged component positions.
3Ease of manufacture
If resin material is used for the frame instead of ceramic, then material cost is reduced, but assembly complexity remains high
Solution Approach 1:
The patent replaces the mechanical joining system of brazed ceramic frames with an adhesive bonding system for resin frames. Instead of requiring high-temperature brazing processes and precise mechanical fits, the resin frames are attached using adhesive that is applied and then cured. This substitution reduces material cost while simplifying the assembly process through lower temperature processing and more tolerant alignment requirements.
Solution Approach 2:
The patent changes the joining parameter from mechanical brazing to chemical adhesive bonding. The resin frame material allows for adhesive attachment at lower temperatures, and the adhesive provides sufficient bonding strength without requiring precise mechanical fits. This parameter change reduces both material cost and assembly complexity by enabling simpler joining procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process significantly reduces assembly time and material costs by allowing the simultaneous assembly of multiple semiconductor devices, improving efficiency and cost-effectiveness while maintaining the structural integrity and performance of the semiconductor devices.
Implementation Method 1
volatilizing solvent contained in the sintered metal paste
Data Source
AI summary
A semiconductor device includes a metal base, a semiconductor chip provided on the metal base, and a frame work located on the metal base and having a metal pattern of an input pattern, an output pattern, and a bias pad. The bias pad and the input pattern or the output pattern are electrically connected by a conductor located on the frame work. The conductor has a characteristic of isolation at a frequency around an input signal or an output signal of the semiconductor device.