Thin Semiconductor Package Structure With Integrated Antenna Wiring
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Solution Overview
Problem
Conventional semiconductor devices require two wiring boards for stacking, leading to increased thickness and complexity in manufacturing, making it difficult to achieve a thin, simple, and fast production process.
Innovation Solution
A thin semiconductor device structure comprising a substrate with a circuit layer, electronic device, wires, and a molding layer, where the electronic device and wires are exposed on the outer surface, and antenna units are coupled to the circuit layer through the molding layer, reducing the need for multiple substrates and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two wiring boards are stacked to protect the chip, then the chip is protected, but the thickness of the semiconductor device increases and the manufacturing process becomes complicated
Solution Approach 1:
The patent merges the chip mounting board and the protective board into a single integrated wiring board structure. The circuit board directly serves as both the mounting substrate and the protective element, eliminating the need for a separate protective board. This integration reduces the overall device thickness while maintaining chip protection through the circuit board's own structural integrity and encapsulation.
Solution Approach 2:
The circuit board is designed to perform multiple functions simultaneously: it serves as the mounting substrate for the chip, provides electrical connectivity through traces and pads, and acts as the protective structure. This multi-functionality eliminates the need for dedicated protective boards, reducing thickness while ensuring chip protection through the board's inherent structural design.
2Reliability
If two wiring boards are stacked to protect the chip, then the chip is protected, but the manufacturing process becomes complicated
Solution Approach 1:
The patent combines the functions of the chip mounting board and protective board into a single circuit board structure. This merger eliminates the need for separate assembly steps to stack and align multiple boards, significantly simplifying the manufacturing process. The single-board design reduces the number of assembly operations, alignment requirements, and potential defects associated with multi-board stacking.
Solution Approach 2:
The patent extracts the protective function from a separate protective board and integrates it into the circuit board itself. By removing the need for a dedicated protective board, the manufacturing process is simplified as fewer components need to be procured, stored, and assembled. The circuit board's structure is optimized to provide protection without requiring additional protective layers or boards.
3Length of stationary object
If a single substrate structure is used to reduce thickness, then the device thickness is reduced, but the chip protection capability may be compromised
Solution Approach 1:
The patent applies local quality by designing the circuit board with enhanced structural features specifically at the chip mounting area. The board incorporates reinforced regions, optimized trace routing, and strategic pad placement around the chip location to provide localized protection. This ensures that while the overall device thickness is reduced, the critical chip mounting region maintains adequate protection through localized structural enhancements.
Solution Approach 2:
The patent incorporates protective features directly into the circuit board design during the manufacturing process, rather than adding separate protective layers after chip mounting. The circuit board is fabricated with built-in protective structures such as encapsulation regions, reinforced substrates, and protective trace patterns that are prepared in advance. This preliminary integration ensures chip protection is inherent to the board structure itself, maintaining protection capability while reducing overall thickness.
Data Source
AI summary
A thin semiconductor device and a method of manufacturing the thin semiconductor device, comprising a substrate with a first surface, a second surface opposite to the first surface, and a circuit layer. An electronic device is disposed on the first surface and is coupled to the circuit layer. A wire is disposed on the first surface and is coupled to the circuit layer. A molding layer covers the substrate and covers part of the electronic device and the wire. A plurality of antenna units is disposed on the molding layer and is coupled to wire. A plurality of connecting units is disposed on the second surface and is coupled to wire.