Interposer Connection Structure for Pitch-Mismatched Component Packaging
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Solution Overview
Problem
Existing electronic component packaging technologies face challenges in efficiently connecting discrete components to substrates, particularly due to mismatches in pitch and line/space resolution between the component and the substrate, leading to increased parasitic capacitance and resistance, and complex manufacturing processes.
Innovation Solution
The use of an interposer with a redistribution layer and conductive features that connect bond pads on the electronic component to corresponding contact pads on the substrate, allowing for electrical connection without through vias, and employing a flexible or elastomeric material to accommodate pitch mismatches and enhance packaging density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging technologies are used to connect discrete components to substrates, then electrical connection is achieved, but pitch and line/space resolution mismatches occur leading to increased parasitic capacitance and resistance
Solution Approach 1:
An interposer substrate is introduced as an intermediary component between the discrete electronic component and the final substrate. The interposer includes a first surface that contacts the electronic component and a second surface that contacts the substrate, with conductive features distributed throughout its body to establish electrical connections. This intermediary structure resolves pitch and resolution mismatches, reducing parasitic capacitance and resistance while improving electrical connection quality.
2Reliability
If traditional connection methods are used, then electrical connection is established, but manufacturing processes become complex
Solution Approach 1:
The conductive features are pre-formed within the interposer substrate body before the final assembly process. The interposer is prepared in advance with its internal conductive network established, allowing for simplified subsequent assembly steps where the interposer is simply positioned between the electronic component and substrate. This preliminary preparation of conductive pathways reduces overall manufacturing complexity.
3Reliability
If rigid connection structures are used, then stable electrical connection is achieved, but packaging flexibility and stretchability are limited
Solution Approach 1:
The interposer substrate is constructed using flexible and/or elastomeric materials that allow the structure to bend, stretch, and deform while maintaining electrical connectivity. The conductive features embedded within the flexible substrate body maintain their conductive pathways even when the substrate undergoes mechanical deformation, enabling the packaging to adapt to different shapes and sizes while preserving stable electrical connections.
Data Source
AI summary
An apparatus includes a first substrate including one or more electrical connection features; and an assembly including: a second substrate; conductive features formed on the second substrate, one or more of which are electrically connected to corresponding electrical connection features of the first substrate; and an electronic component between the second substrate and the first substrate and electrically connected to one or more of the conductive features.