PCB Interface Terminal Bracket Structure for Thin USB Assembly
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Solution Overview
Problem
As electronic devices become thinner, it is challenging to efficiently arrange and assemble components such as USB connectors due to space constraints, making it difficult to use assembly devices like jigs effectively.
Innovation Solution
The electronic device incorporates a PCB with an interface terminal featuring a shell, a non-conductive plate, and brackets that cover the shell, including a protrusion on the second bracket to facilitate assembly, allowing for the use of assembly devices like jigs for efficient placement and mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If electronic devices are made thinner, then the slim form factor is improved, but the ease of assembly and space for components deteriorates
Solution Approach 1:
The interface terminal is divided into multiple segments: shell, terminal structure, first bracket, and second bracket. This segmentation allows each component to be independently manufactured and positioned, enabling automated assembly devices to efficiently place the terminal on the PCB despite the thin device profile.
Solution Approach 2:
The brackets extend in the thickness direction (z-axis) of the device, utilizing the third dimension to provide assembly features. The first and second brackets cover opposite surfaces of the shell, creating protrusions that extend beyond the shell's outer surfaces, enabling jig engagement for automated assembly without increasing the device's planar footprint.
2Length of moving object
If components are arranged more densely, then the device thickness is reduced, but the assembly precision and component placement difficulty increase
Solution Approach 1:
The brackets are pre-formed with specific protrusion features that extend beyond the shell's outer surfaces. These protrusions are positioned in advance to engage with assembly device jigs, ensuring precise component placement during automated assembly without requiring complex positioning operations.
Solution Approach 2:
The brackets serve as intermediary elements between the interface terminal and the PCB. The protrusions on the brackets act as mediators that interface with the assembly device jigs, transferring positioning information and ensuring accurate placement of the interface terminal on the PCB during automated assembly.
3Productivity
If automated assembly devices are used, then productivity is improved, but the device structure complexity increases
Solution Approach 1:
The brackets serve multiple functions: they provide structural support for the interface terminal, enable automated assembly through protrusion features, and maintain the thin device profile. This multi-functionality allows automated assembly devices to be used without significantly increasing overall device complexity.
Solution Approach 2:
The protrusions on the brackets are self-forming features that automatically engage with the assembly device jigs during the assembly process. The structure serves itself by providing the necessary assembly features as an integral part of the component design, eliminating the need for additional specialized assembly mechanisms.
Data Source
AI summary
An electronic device is provided, which includes a printed circuit board (PCB) including a first surface and a second surface facing in a direction opposite to the first surface; and an interface terminal positioned at least partially on the first surface of the PCB, The interface terminal includes a shell including a hollow portion extending from a first opening on a first side of the shell to a second opening on a second side of the shell, a terminal structure including a non-conductive plate positioned in the hollow portion and a plurality of terminals positioned on the non-conductive plate, a first bracket that at least partially covers a surface of the shell, and a second bracket that at least partially covers another surface of the shell. The second bracket includes a protrusion protruding with respect to the second surface of the PCB.