Sidefill Mounting Board Venting to Prevent Resin Voids
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Solution Overview
Problem
The existing method of using a sidefill resin to reinforce connections between semiconductor components and boards can lead to the formation of holes due to air and moisture expansion during curing, which damages solder joints and affects the quality of the mounting board, especially in environments with vibrations and temperature changes.
Innovation Solution
Incorporating through-holes in the mounting board and electronic components to allow air and moisture to escape, preventing the formation of holes in the sidefill resin by connecting these holes to the space between the board and the component, thereby maintaining the integrity of the resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a sidefill resin is applied to seal the gap between the board and electronic component, then connection reinforcement is improved, but hole formation in the resin occurs due to air and moisture expansion during curing
Solution Approach 1:
The patent introduces through-holes in the electronic component package body before the sidefill resin is applied. These through-holes are pre-positioned to allow air and moisture to escape during the curing process, preventing hole formation in the resin while maintaining connection reinforcement benefits
Solution Approach 2:
The through-holes act as intermediary channels that mediate between the sealed gap space and the external environment. They allow controlled escape of air and moisture during curing without compromising the sealing function of the sidefill resin, thus resolving the contradiction between reinforcement and resin integrity
2Stability of the object's composition
If the gap space is sealed by sidefill resin, then connection stability is improved, but air and moisture expansion causes holes to form in the resin
Solution Approach 1:
Through-holes are pre-formed in the electronic component package body before resin application and curing. This preliminary action ensures that escape paths for air and moisture are already in place, preventing hole formation in the resin while maintaining connection stability
Solution Approach 2:
The patent introduces controlled porosity through the through-holes in the package body, allowing selective passage of air and moisture during curing. This controlled porosity prevents resin defect formation while maintaining the overall stability of the connection structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents the formation of holes in the sidefill resin, enhancing the reliability and durability of the mounting board by allowing air and moisture to exit, thus reducing damage to solder joints and improving the overall quality of the board.
Implementation Method 1
when heating is performed to cure the resin of the sidefill, air or moisture in the sealed space may expand to form a hole in the resin of the sidefill
Data Source
AI summary
There is provided a mounting board including: a printed board; an electronic component surface-mounted on the printed board; and a resin for a sidefill applied to an outer periphery of the electronic component. At least one of the printed board and the electronic component includes a through-hole connected to a space defined by the printed board, the electronic component, and the resin for the sidefill.