Stacked Patch Antenna Package With Ground-Wall Decoupling
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Solution Overview
Problem
Increasing RF frequencies pose challenges for RF integrated circuit packages, particularly in maintaining resonance properties and reducing crosstalk between patch antennas due to constraints on acceptable RF component sizes and variations in manufacturing processes.
Innovation Solution
A stacked antenna package arrangement featuring a first substrate with patch antennas and decoupling capacitors between them, where the decoupling capacitors form a ground wall between adjacent antennas, providing both electrical isolation and setting the height between substrates to stabilize antenna performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If decoupling capacitors are placed between adjacent patch antennas, then crosstalk between antennas is reduced, but device complexity increases
Solution Approach 1:
The decoupling capacitors are integrated between adjacent patch antennas in a stacked arrangement, merging the decoupling function with the antenna structure. This consolidation reduces the need for separate decoupling components while effectively reducing crosstalk between antennas.
Solution Approach 2:
Decoupling capacitors are positioned as intermediary elements between adjacent patch antennas, acting as mediators to isolate electromagnetic interference. The capacitors are strategically placed to block harmful electromagnetic coupling while maintaining the compact stacked architecture.
2Manufacturing precision
If the gap between substrates is reduced to minimize manufacturing variations, then manufacturing precision is improved, but resonance properties of antennas are affected
Solution Approach 1:
The height of the decoupling capacitors is specifically designed to define and control the gap between substrates. By changing the capacitor height parameter, the system achieves a stable gap dimension that minimizes manufacturing variations while preserving antenna resonance properties.
Solution Approach 2:
The decoupling capacitors are pre-positioned between substrates to cushion and stabilize the gap distance before final assembly. This beforehand positioning compensates for potential manufacturing variations, ensuring consistent resonance properties without requiring tight manufacturing tolerances.
3Productivity
If RF component sizes are reduced to meet frequency constraints, then productivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
Decoupling capacitors are nested within the stacked substrate arrangement, with capacitors positioned between substrates in a compact configuration. This nesting approach minimizes the overall footprint of RF components while maintaining stable electrical characteristics and reducing sensitivity to manufacturing variations.
Solution Approach 2:
The system transitions from a planar arrangement to a three-dimensional stacked configuration, placing decoupling capacitors in the vertical dimension between substrates. This dimensional change allows compact RF component sizing while the vertical stacking provides mechanical stability that reduces manufacturing variation sensitivity.
Data Source
AI summary
An antenna package and method of manufacturing an antenna package is disclosed. The antenna package includes a first substrate and second substrate in a stacked arrangement. A first plurality of patch antennas and a plurality of decoupling capacitors is arranged on a first major surface of the first substrate. One or more decoupling capacitor of the plurality of decoupling capacitors is located between adjacent patch antennas of the first plurality of patch antennas. The second substrate includes a second plurality of patch antennas. One or more decoupling capacitors of the plurality of decoupling capacitors includes a first terminal configured to be in contact with the first substrate and a second terminal configured to be in contact with the first substrate and the second substrate.