Stacked Patch Antenna Package With Capacitor Ground Wall
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Solution Overview
Problem
Increasing RF frequencies in RF integrated circuit packages pose a challenge for the design of RF components, particularly in WLAN and 6G communication applications, where supply decoupling capacitors are required, but the constraints on component size affect the resonance properties and RF performance due to variations in substrate height and crosstalk between patch antennas.
Innovation Solution
The antenna package incorporates a stacked arrangement of substrates with decoupling capacitors positioned between patch antennas, where the capacitors form a ground wall and have terminals extending across multiple sidewalls to provide a stable ground continuity and reduce crosstalk, also acting as height setters to minimize manufacturing variations and optimize RF performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If decoupling capacitors are added to RF integrated circuit packages, then RF performance is improved, but device complexity increases
Solution Approach 1:
The decoupling capacitor is merged with the ground structure by extending the second terminal as a metal region across sidewalls and the second surface of the capacitor to contact the second substrate. This integration combines the decoupling function with the ground wall function, improving RF performance while avoiding the need for separate ground structures.
Solution Approach 2:
The decoupling capacitor structure serves multiple functions: it provides decoupling capacitance for power supply stabilization, forms a ground wall between adjacent patch antennas to reduce crosstalk, and acts as a height setter to define the separation between first and second substrates. This multi-functionality addresses multiple requirements simultaneously without proportionally increasing device complexity.
2Productivity
If component sizes are reduced to meet space constraints, then productivity is improved, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The ground wall function is merged into the decoupling capacitor structure rather than being a separate component. The metal region extending from the capacitor terminals creates the ground wall, eliminating the need for additional ground structures and reducing overall component count and space requirements while maintaining manufacturing precision.
Solution Approach 2:
The decoupling capacitor serves as multiple functions including ground wall formation and height setting. By making the capacitor structure itself perform multiple roles, the design reduces the number of separate components needed, improving space utilization without compromising manufacturing precision through complex assembly of multiple small parts.
3Volume of stationary object
If substrate height is reduced to minimize package size, then volume is improved, but stability of the object's composition deteriorates
Solution Approach 1:
The decoupling capacitor serves as a height setter that defines the separation between first and second substrates. The capacitor's physical dimensions establish a stable reference height, ensuring consistent substrate spacing while maintaining compact package dimensions. This multi-functional role of the capacitor provides stability without requiring additional height-setting structures.
Data Source
Figure 1A~1D
Figure 2A~2D
Figure 3A~4B
AI summary
An antenna package and method of manufacturing an antenna package is disclosed. The antenna package includes a first substrate and second substrate in a stacked arrangement. A first plurality of patch antennas and a plurality of decoupling capacitors is arranged on a first major surface of the first substrate. One or more decoupling capacitor of the plurality of decoupling capacitors is located between adjacent patch antennas of the first plurality of patch antennas. The second substrate includes a second plurality of patch antennas. One or more decoupling capacitors of the plurality of decoupling capacitors includes a first terminal configured to be in contact with the first substrate and a second terminal configured to be in contact with the first substrate and the second substrate.