Organic Bridge Interconnect Structure to Prevent Package Delamination
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Solution Overview
Problem
Traditional multi-chip module (MCM) formats face issues with delamination and cracking due to the mismatch in thermal expansion coefficients between organic package substrates and silicon bridges, leading to manufacturing challenges and reduced reliability of high-density interconnects.
Innovation Solution
The use of an organic bridge within an organic package substrate, made from an organic polymer like epoxy, which has better interfacial adhesion and minimizes material mismatch issues by conforming to the substrate contours, allowing for high-density interconnects without the need for a silicon substrate, thus reducing delamination and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a silicon bridge is used to increase local IO density, then the number of IO interconnections is improved, but delamination and cracking occur due to CTE mismatch between organic package and silicon bridge
Solution Approach 1:
The patent replaces the silicon bridge with an organic bridge made from the same organic polymer material as the package substrate. This material homogeneity eliminates the CTE mismatch between dissimilar materials (silicon and organic substrate), preventing delamination and cracking while maintaining the high-density interconnect function.
Solution Approach 2:
The patent changes the material parameter of the bridge from silicon to organic polymer, fundamentally altering the CTE parameter to match the substrate. This parameter change resolves the thermal expansion mismatch issue while preserving the bridge's interconnect functionality.
2Quantity of substance
If multiple process steps are used to embed silicon bridge, then local IO density is improved, but manufacturing complexity increases leading to cracking and delamination
Solution Approach 1:
The patent merges the bridge manufacturing process with the substrate manufacturing process. Both the organic substrate and organic bridge are fabricated using the same organic polymer material and similar fabrication techniques, allowing them to be produced in an integrated manner rather than requiring separate silicon bridge fabrication and embedding steps.
3Quantity of substance
If silicon bridge is made ultra-thin to increase IO density, then the number of interconnections is improved, but embedding becomes challenging
Solution Approach 1:
The organic bridge is made from the same organic polymer as the substrate, ensuring material compatibility throughout the embedding process. This homogeneity allows the thin bridge to be seamlessly integrated into the substrate without the interface problems that plague silicon bridge embedding.
Data Source
AI summary
Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.