Display Panel OLB Layout With COF Bridging to Cut Driver Complexity
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Solution Overview
Problem
The increasing size and diversity of display apparatuses require more electronic components for driving display panels, leading to higher costs and potential failures, which existing technologies have not adequately addressed.
Innovation Solution
A display panel design that includes a substrate with an active area and an outer lead bonding (OLB) area, where Chip On Film (COF) components are coupled with printed circuit boards (PCBs) and conductive patterns, allowing for reduced electronic components, improved connectivity, and cost efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic components are added to drive larger and more diverse display panels, then the driving capability is improved, but the device complexity and cost increase
Solution Approach 1:
The patent combines multiple COF components into a single integrated structure where multiple COFs are coupled to a shared PCB through conductive patterns formed on a single substrate. This merging approach maintains the driving capability for large and diverse display panels while reducing the overall number of separate electronic components and assemblies required.
Solution Approach 2:
The PCB is designed with multiple COFs coupled to it, each serving different driving functions for various regions of the display panel. This universal structure allows a single PCB to perform multiple driving tasks that would traditionally require separate components, thereby reducing device complexity while maintaining versatility.
2Adaptability or versatility
If multiple electronic components are added to drive larger and more diverse display panels, then the driving capability is improved, but the manufacturing cost increases
Solution Approach 1:
By merging multiple COF components into a single integrated assembly coupled to one PCB, the patent reduces the total number of parts that need to be manufactured, stored, and assembled. This consolidation lowers manufacturing costs while maintaining the enhanced driving capability needed for large and diverse display panels.
3Adaptability or versatility
If more electronic components are used, then the signal transmission capability is improved, but the reliability decreases due to more potential failure points
Solution Approach 1:
The patent reduces the number of discrete electronic components by integrating multiple COFs into a unified structure with a single PCB. This consolidation decreases the total number of potential failure points while maintaining adequate signal transmission capability through the conductive patterns that efficiently connect all COFs to the shared PCB.
4Productivity
If multiple COFs are coupled to separate PCBs, then the signal transmission is improved, but the device complexity increases
Solution Approach 1:
The patent merges multiple COFs into a single structural assembly that couples to one PCB through conductive patterns. This approach maintains efficient signal transmission by providing direct conductive paths from each COF to the PCB, while simultaneously reducing structural complexity by eliminating the need for multiple separate PCB assemblies.
Data Source
AI summary
A display apparatus includes a substrate including an active area including a plurality of pixels, and an outer lead bonding (OLB) area; a first Chip On Film (COF) coupled to the OLB area; a second COF coupled to the OLB area and adjacent to the first COF; a first printed circuit board (PCB) coupled to the first COF; and a second PCB coupled to the second COF, wherein the OLB area may include a first area to which the first COF is coupled, a second area to which the second COF is coupled, and a dummy area between the first area and the second area, and the dummy area may include a conductive pattern electrically connecting the first COF and the second COF.