Silicon Photonics Chip Cooling With Recessed PCB Thermal Layout
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Solution Overview
Problem
Conventional heat removal methods for semiconductor devices, particularly photonic chips, require bulky configurations and high power consumption, often leading to inadequate cooling and temperature instability, which affects the operational reliability and efficiency of network devices.
Innovation Solution
A semiconductor device assembly featuring a multi-layer printed circuit board with a lateral heat conducting path and a thermoelectric cooler (TEC) configured to evacuate heat from a silicon photonics chip, using a compact design that isolates heat removal from other components, allowing adaptive control to maintain stable temperatures and reduce power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat removal methods are used for photonic chips, then heat can be removed from the device, but the configuration becomes bulky and power consumption increases
Solution Approach 1:
The patent embeds the thermoelectric cooler directly within the PCB structure, nesting the cooling function inside the existing board geometry rather than adding external cooling components. The TEC is positioned in a recessed area of the PCB, creating a compact integrated solution that removes heat from photonic chips without increasing overall device form factor.
Solution Approach 2:
The patent combines multiple functions into the PCB structure: the PCB serves as both the electrical interconnection medium and the thermal management system. The lateral heat conducting path is integrated into the PCB layers, merging structural support, electrical connectivity, and heat removal functions into a single unified component.
2Temperature
If conventional heat removal methods are used for photonic chips, then heat can be removed from the device, but power consumption increases
Solution Approach 1:
The patent extracts the heat removal function from separate external cooling systems and integrates it directly into the PCB structure. By placing the TEC in close thermal contact with the photonic chip through the lateral heat conducting path, the system achieves efficient heat removal with reduced power consumption compared to conventional external cooling methods.
Solution Approach 2:
The lateral heat conducting path formed by PCB layers acts as an intermediary thermal conduit between the photonic chip and the TEC. This intermediate thermal path efficiently transfers heat laterally to the cooling element, improving thermal coupling and reducing the power required for effective heat removal.
3Reliability
If conventional heat removal methods are used, then heat can be removed from photonic chips, but temperature stability is inadequate affecting operational reliability
Solution Approach 1:
The patent segments the thermal management system into dedicated zones: a recessed area for the TEC and photonic chip, and an un-recessed area for other components. This segmentation isolates the temperature-sensitive photonic chip from thermal interference by other components, improving temperature stability and operational reliability.
Solution Approach 2:
The patent applies different thermal characteristics to different regions of the PCB. The recessed area containing the photonic chip and TEC is thermally isolated and optimized for active cooling, while the un-recessed area allows passive heat dissipation for other components. This local differentiation of thermal properties ensures stable operating conditions for temperature-sensitive photonic devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains photonic device temperatures within a stable range, enabling high data-rate communication while reducing the form factor and power requirements, thereby enhancing the reliability and efficiency of network devices.
Implementation Method 1
The TEC is configured to evacuate heat from the chip via the lateral heat conducting path
Implementation Method 2
dissipate the evacuated heat via a first end of a heat sink in thermal contact with the TEC
Implementation Method 3
the lateral heat conducting path includes heat conducting layers of the PCB, which are in thermal contact with an external surface of the heat conducting path via vertical heat conducting channels
Data Source
AI summary
A semiconductor device assembly (10) includes a multi-layer printed circuit board (PCB—40), a thermoelectric cooler (TEC—30), a chip (22), and packaged integrated circuitry (IC—26). The multi-layer PCB includes a lateral heat conducting path (60) formed in a recessed area (44) of the PCB. The TEC and the chip are disposed on the PCB, side-by-side to one another over the lateral heat conducting path. The TEC is configured to evacuate heat from the chip via the lateral heat conducting path, and to dissipate the evacuated heat via a first end of a heat sink (33) in thermal contact with the TEC. The packaged IC is disposed on an un-recessed area of the PCB, wherein the packaged IC is configured to dissipate heat via a second end of the heat sink that is in thermal contact with the packaged IC.