Wiring Substrate Via Layout for Shared Mini LED Microchip Arrays
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Solution Overview
Problem
The development of Mini LED backlight substrates is hindered by the need for different wiring distributions for various microchips, leading to increased development cycles and costs, as well as complexity in sharing masks and intermediate substrates, which complicates the process and reduces productivity.
Innovation Solution
A wiring substrate with a specific arrangement of control regions and via holes that allows for flexible connection of different microchips, enabling the use of a shared process and equipment for multiple array substrates, thereby simplifying the production and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different wiring distributions are designed for various microchips, then the compatibility with different microchips is improved, but the device complexity and development cost increase
Solution Approach 1:
The patent implements a universal wiring substrate design where the control region rows and columns are arranged in a standardized grid pattern that can accommodate multiple microchip types. The via holes are positioned at standardized locations within each control region, allowing different microchips to be mounted on the same substrate type with minimal modifications, thus achieving multi-functionality and reducing the need for multiple specialized substrate designs
Solution Approach 2:
The substrate is divided into multiple control regions arranged in rows and columns, with each control region containing standardized via hole patterns. This segmentation allows the substrate to be designed once with a universal structure that can support different microchip configurations, reducing overall complexity while maintaining adaptability
2Manufacturing precision
If different masks and intermediate substrates are used for different backlight substrates, then the manufacturing precision for specific microchips is improved, but the productivity and development efficiency decrease
Solution Approach 1:
The patent creates a universal mask design that can be used across multiple backlight substrate productions. The standardized control region arrangement with consistent via hole patterns allows a single mask set to serve multiple microchip types, eliminating the need to develop separate masks for each microchip variant, thus improving productivity while maintaining manufacturing precision
Solution Approach 2:
The wiring substrate is designed in advance with pre-defined control region rows and columns and standardized via hole positions. This preliminary structuring allows different microchips to be accommodated without requiring subsequent mask redesigns or intermediate substrate modifications, streamlining the development process
3Adaptability or versatility
If multiple specialized backlight substrates are developed for different microchips, then the adaptability to specific microchip requirements is improved, but the development cost and cycle increase
Solution Approach 1:
The patent develops a single universal backlight substrate design that can serve multiple microchip types. The standardized control region arrangement allows the same substrate to be used with different microchips by simply changing the microchip mounting configuration rather than developing entirely new substrates, significantly reducing development time and cost while maintaining adaptability
Data Source
AI summary
The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.