Multi-Diameter Female Contacts for Low-Crosstalk VPX Connectors
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Solution Overview
Problem
Current industry standard VPX connectors face challenges in supporting high data rates due to signal degradation from crosstalk, particularly at 25 Gbps, which is exacerbated by the close proximity of conductive paths, leading to undesirable Bit Error Rates (BER) and manufacturing complexities in reducing via diameter and increasing separation within connectors.
Innovation Solution
The electronic device incorporates a connector with conductive pins and a circuit board featuring spaced apart female contacts with conductive tubular vias and cups, where the conductive cup has an outer diameter 1.5 to 2.5 times that of the via, and a height of 0.1 to 0.5 times the via height, allowing for reduced crosstalk and simplified manufacturing through drilling and plating processes, enabling reliable high-speed connections up to 25 GHz.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the separation between conductive paths is increased to reduce crosstalk, then signal integrity is improved, but the connector size and device complexity increase
Solution Approach 1:
The patent applies local quality by varying the via diameter along the via length - smaller diameter at the top (near the connector) and larger diameter at the bottom (in the backplane). This local variation allows the via to provide both crosstalk reduction (small top diameter) and mechanical strength/signal integrity (large bottom diameter) without increasing overall connector size.
Solution Approach 2:
The patent changes the geometric parameter of the via by creating a non-uniform diameter profile. The via transitions from a smaller diameter at the top to a larger diameter at the bottom, optimizing both electrical performance (reduced crosstalk) and mechanical properties (increased strength) within the same spatial footprint.
2Reliability
If the via diameter is reduced to minimize crosstalk, then signal degradation is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The via is segmented into two distinct zones with different diameters - a top portion with smaller diameter for crosstalk reduction and a bottom portion with larger diameter for manufacturing robustness. This segmentation allows each zone to be optimized for its specific function while using standard manufacturing capabilities.
Solution Approach 2:
The patent performs preliminary drilling to create the via hole before plating, allowing the via geometry to be established first. The non-uniform diameter is achieved through controlled drilling or etching processes that create the tapered or stepped profile before conductive material is added, simplifying the overall manufacturing sequence.
3Reliability
If multiple lamination steps are used to manufacture the female contact, then the connector can survive harsh environments, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the via formation and conductive cup formation into a single integrated structure. The non-uniform via itself serves as both the mechanical support and the electrical conductor, eliminating the need for separate lamination steps to create the conductive cup, thereby reducing manufacturing complexity while maintaining environmental durability.
Solution Approach 2:
The via structure combines different materials or material states - the dielectric material forming the via wall and the conductive material (copper or other metal) plated within. This composite construction provides both mechanical strength and electrical conductivity in a single integrated component that can withstand harsh environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing complexity and costs while maintaining signal integrity, achieving higher yields and compact connector spacing, effectively addressing crosstalk issues and supporting high data throughput with reduced Bit Error Rates.
Implementation Method 1
Each female contact may comprise a conductive tubular via, a core within the conductive tubular via, and a conductive cup having a lower end abutting and joined to the conductive tubular via
Implementation Method 2
vertically extending vias formed by a drilling and plating process, which comprise conductive materials, for example, copper or other metal or alloy
Data Source
AI summary
An electronic device may include a connector having a connector body and conductive pins extending outwardly from the connector body, and a circuit board having a dielectric layer, and spaced apart female contacts extending therein. Each female contact may include a conductive tubular via, a core within the conductive tubular via, and a conductive cup having a lower end abutting and joined to the conductive tubular via and an upper end defining a recess receiving a corresponding conductive pin of the connector. The conductive cup may have an outer diameter greater than an outer diameter of the conductive tubular via.