Chip Package Reinforced Positive Alignment Features
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Solution Overview
Problem
Existing chip packaging technologies face challenges in achieving high alignment accuracy and reliability due to the limitations of additive features, which are prone to failure under shear forces and thermal expansion, making them unsuitable for multi-chip modules (MCMs) that require high-density and high-performance systems.
Innovation Solution
A chip package with a substrate featuring a positive mechanical reinforcement mechanism that increases the shear strength of the positive features, allowing for accurate alignment and assembly of semiconductor chips, using materials like patterned metal or cured adhesives, and allowing for reflow or partial melting during assembly to enhance mechanical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If additive processes are used to fabricate positive features, then manufacturing complexity is reduced and compatibility with semiconductor fabrication processes is improved, but the features have poor adhesion to substrates and fail under lateral shear forces
Solution Approach 1:
The patent uses a composite structure combining an additive-fabricated positive feature (providing alignment geometry) with a separate mechanical reinforcement layer (providing shear strength). The reinforcement layer is deposited over the additive feature to create a composite structure that maintains both manufacturing ease and mechanical strength.
Solution Approach 2:
The patent changes the physical state or properties of the material by applying thermal energy to melt and reflow the patterned metal, transforming it from a brittle deposited state to a ductile molten state that can conform to the positive feature geometry and then solidify into a mechanically strong reinforcement structure.
2Manufacturing precision
If multiple assembly operations are used with positive and negative features, then alignment accuracy is improved, but assembly complexity and time increase
Solution Approach 1:
The patent extracts the alignment function from the traditional ball-and-pit system and implements it using only positive features on one substrate that mate with corresponding features on another substrate. This eliminates the need for complex multi-step alignment operations while maintaining high alignment accuracy through the reinforced positive feature geometry.
Solution Approach 2:
The reinforced positive features are designed to self-align components during assembly through their geometric configuration and mechanical coupling, eliminating the need for external alignment tools or multiple adjustment operations. The features automatically guide and secure component positioning.
3Strength
If subtractive processes are used to fabricate positive features, then structural stability and shear force resistance are improved, but compatibility with semiconductor fabrication processes deteriorates
Solution Approach 1:
The patent merges two previously separate processes: additive fabrication (for creating the positive feature geometry compatible with semiconductor processes) and subtractive-like reinforcement (through metal deposition and reflow that creates structurally stable features). The combination achieves both fabrication compatibility and structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability and manufacturing throughput of MCMs by providing robust mechanical alignment and assembly, enabling lower-cost integration of multiple chips with improved performance and structural integrity.
Implementation Method 1
a patterned metal that is reflowed so it conforms to a shape of the positive feature
Implementation Method 2
a cured material (such as an adhesive and/or an epoxy)
Implementation Method 3
the mechanical reinforcement mechanism increases the shear strength of the positive feature relative to the substrate
Data Source
AI summary
A chip package includes a substrate having a positive feature, which is defined on a surface of the substrate and which protrudes above a region on the surface proximate to the positive feature. Furthermore, the chip package includes a mechanical reinforcement mechanism defined on the substrate proximate to the positive feature that increases a lateral shear strength of the positive feature relative to the substrate. In this way, the chip package may facilitate increased reliability of a multi-chip module (MCM) that includes the chip package.