Chip Package With Ring-Shaped Protrusion for Photo-Sensitive Area Protection
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Solution Overview
Problem
Conventional chip packaging processes are inefficient in protecting photo-sensitive areas from dust particles and impurities, leading to reduced sensitivity and yield in electronic devices like digital cameras and video cameras.
Innovation Solution
A chip package design featuring ring-shaped protrusions and bumps that connect a semiconductor chip to a transparent substrate, forming an airtight space to minimize exposure to external particles, with the fabrication process allowing for reduced contamination by separating sensitive steps between clean rooms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the transparent substrate is joined to the semiconductor chip using conventional adhesive material in a packaging factory, then the packaging process can be completed, but dust particles and impurities will contaminate the photo-sensitive area during the process
Solution Approach 1:
The patent applies preliminary action by forming the airtight space structure (ring-shaped protrusion + bump configuration) before the chip packaging process. This pre-formed structure creates a protected environment that prevents particle contamination during subsequent adhesive application and packaging steps, eliminating the need for extreme clean room conditions during manufacturing.
Solution Approach 2:
The patent introduces an intermediary mechanism (the airtight space formed by ring-shaped protrusions and bumps) that mediates between the external contaminated environment and the photo-sensitive area. This intermediary structure allows conventional adhesive materials to be applied without directly exposing the photo-sensitive area to contaminants.
2Reliability
If multiple separate steps are used to form the connection structure between semiconductor chip and transparent substrate, then the connection can be achieved, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent merges multiple functions into a unified structure: the ring-shaped protrusion serves simultaneously as a mechanical connector, a seal for the airtight space, and a structural support element. The bump structures provide both electrical connection and positioning functions, reducing the number of separate fabrication steps needed.
Solution Approach 2:
The connection structure exhibits multi-functionality: the ring-shaped protrusion provides mechanical attachment, creates an airtight seal, and defines the bonding area for adhesive material. The bump structures provide electrical connectivity, mechanical support, and alignment reference, eliminating the need for separate components for each function.
3Productivity
If the photo-sensitive area is exposed during the packaging process in a standard clean room, then the packaging can be completed, but the sensitivity and yield of the device are reduced
Solution Approach 1:
The airtight space structure is preliminarily formed with the chip and substrate before packaging operations begin. This pre-established protective enclosure allows subsequent packaging steps (adhesive application, wire bonding, etc.) to proceed without requiring the photo-sensitive area to remain exposed, maintaining both productivity and precision.
Solution Approach 2:
The patent converts the potential harm of standard clean room conditions into a benefit by using the airtight space structure to actively protect the photo-sensitive area. The same manufacturing environment that would normally cause contamination becomes acceptable because the airtight structure prevents contaminants from reaching the sensitive area, thereby maintaining yield while enabling higher productivity.
Data Source
AI summary
A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip.