Chip Package With Side Recess For Layout Flexibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional chip packaging processes are costly and time-consuming due to multiple patterning and material-deposition processes, necessitating a simplified and faster method.
Innovation Solution
A chip package design featuring a semiconductor substrate with a side recess and a conducting layer extending to the recess, which reduces the overall size and increases layout flexibility by allowing for reduced height and enhanced electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional multiple patterning and material-deposition processes are used for chip packaging, then manufacturing precision and reliability are maintained, but manufacturing cost increases and processing time extends
Solution Approach 1:
The patent segments the packaging structure into distinct functional zones: an active area with device regions containing semiconductor devices, and a peripheral area with side recesses for electrical connection. This segmentation allows different regions to be processed and connected independently, simplifying the overall manufacturing process while maintaining precision.
Solution Approach 2:
The patent introduces side recesses that extend from the first surface toward the second surface, creating a third-dimensional electrical connection path. This vertical dimensionality change eliminates the need for complex lateral routing and multiple deposition layers, significantly reducing processing time while maintaining connection reliability.
2Reliability
If conventional packaging structures are used, then electrical connectivity is ensured, but package size increases and layout flexibility decreases
Solution Approach 1:
The side recesses create vertical electrical connection paths from the first surface toward the second surface, utilizing the Z-dimension for electrical connectivity. This eliminates the need for large lateral connection areas, significantly reducing the overall package footprint while ensuring reliable electrical connections.
Solution Approach 2:
The patent applies different structural characteristics to different regions: the active area maintains full thickness for device functionality, while the peripheral areas feature side recesses for compact electrical connection. This local differentiation optimizes both connectivity and size without compromising overall reliability.
3Manufacturing precision
If conventional packaging processes are used, then manufacturing precision is maintained, but manufacturing cost increases
Solution Approach 1:
The patent divides the wafer into active device regions and peripheral connection regions, allowing standard high-precision semiconductor fabrication processes to be used only where needed for device creation, while simpler processes form the peripheral side recesses and conducting layers, thereby reducing overall manufacturing cost while maintaining device precision.
Solution Approach 2:
The side recesses serve multiple functions: they provide electrical connection pathways, define package boundaries, and enable compact layout. This multi-functionality eliminates the need for separate structures for each purpose, reducing the number of manufacturing steps and associated costs while maintaining connection reliability.
Data Source
AI summary
An embodiment of the invention provides a chip package including a semiconductor substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A side recess is on at least a first side of the semiconductor substrate, wherein the side recess extends from the first surface toward the second surface and across the entire length of the first side. A conducting layer is located on the first surface and electrically connected to the conducting pad, wherein the conducting layer extends to the side recess.