Semiconductor/Solid-State Device Details TRIZ Cases
- Semiconductor Interconnect Air Gap Structure for RC Delay Reduction
Self-aligned air gaps lower dielectric constant to minimize RC delay in high-density semiconductor back-end-of-line interconnects.
- Cascoded Transistor Protection for MRAM Antifuses
Serial cascoded transistors protect unselected magnetic tunnel junction antifuses from voltage-induced degradation during high-voltage programming.
- Solder on Slot Connections in Package-on-Package Structures
Slot openings in passivation layers expose conductive traces for direct solder coupling, eliminating photolithography steps that increase manufacturing costs.
- Chip Package With Side Recess For Layout Flexibility
Side recesses in the semiconductor substrate enable vertical connection paths, reducing processing time and cost.
- Flexible Conductive Contacts for ECMP Wafer Planarization
A flexible conductive contact system integrates inert noble metal coatings on insulative substrates to maintain electrical conductivity during electrochemical planarization.
- Half-Bridge Package With Common Heat Sink for Thermal Dissipation
A common heat sink electrically connects half-bridge switches while dissipating heat, reducing constructive complexity and size.
- Conductive Sandwich Composites for Flexible Interconnects
Silver-PDMS core layers within sandwich structures preserve conductivity during 120% stretching, solving strain-induced signal loss.
- Indium Arsenide Interlayer for Low Contact Resistivity
Inserting an indium arsenide layer reduces Schottky barrier height, enabling drive current preservation beyond the 22 nm node.
- Semiconductor Bus Segmentation for Electromigration Reduction
Segmented bus configuration with inter-bus interconnect restricts current flow between independent conductive paths.
- Silicon Oxide Film Deposition Rate Enhancement
A silicon oxide film forms via CVD using ethoxy or amino silicon sources to achieve rapid deposition rates on semiconductor underlayers.
- Wafer-Scale Bumpless Device Assembly via Pre-Formed Conductive Pads
Pre-formed conductive layers on semiconductor contact pads enable direct metallurgical bonding to wiring boards without melting.
- Wafer Wet Singulation via Backside Dicing Trenches
Backside dicing trenches filled with filler material enable wet singulation, eliminating saw-induced crack propagation and metal crackstop structures.
- Uniform Height Insulating Layer for Semiconductor Die Standoff
Uniform height insulating pillars prevent bump bridging and collapse during reflow by maintaining precise spacing between the semiconductor die and substrate.
- Nitrided Barrier Layers Preventing Copper Volcano Defects in Semiconductor Vias
A nitridation treatment increases nitrogen doping concentration in via barrier layers to enhance structural strength.
- Thin-Film Resistor Module With HDP Ridge Removal
A thin-film resistor module uses high density plasma ridge removal to define a cup-shaped structure with shortened vertical ridges.
- Chip Scale Package Wafer-Level EMI Shielding
Wafer-level chip scale package structure with integrated shielding layer resolves thickness constraints and electromagnetic interference vulnerability.
- Microporous Wick Cooling for High-Power Thermal Management
A microporous wick structure enhances heat removal through capillary action and phase-change cooling.
- Double-Sided Flip-Chip LED on Leadframe
Flip-chip LED dies mount on both leadframe sides via adhesive sheets, eliminating wire shadows and multiple heating steps.
- Segmented Heat Dissipation Block for Semiconductor Modules
A segmented heat dissipation block uses distinct material hardness zones to maintain grinding wheel performance during semiconductor module manufacturing.
- Silicon Carbide Device Silicide Contact Resistance
A silicon carbide device uses a second silicide electrode to create low resistance contacts with polysilicon layers.
- Semiconductor Via Plug Diameter Tapering for Pad Layout
Tapered via plugs connect bonded semiconductor chips while reducing material usage.
- Inclined Fluid Channel Heat Dissipation Substrate for Semiconductor Packaging
An inclined fluid channel in a heat dissipation substrate increases coolant flow rate and uniformity, reducing temperature variations across semiconductor dies.
- Colored Auxiliary Joining Agent for Semiconductor Mounting
Color changes in the solvent enable visual detection of remaining agent volume, preventing insufficient joint formation.
- pH Sensor Bonding Agent Strip Pattern for Deep-Sea Accuracy
Patterned bonding agent strips exploit CTE mismatch to offset pressure-induced piezoresistive errors in deep-sea pH sensors.
- Fingerprint Sensor Package with Hardened Encapsulant
A fingerprint sensor package uses a ceramic-filled encapsulant to increase Mohs hardness and protect the sensing area.
- Air Gap Formation in IC Interconnects Using Sacrificial Films
Porous dielectric caps support structural integrity while sacrificial film removal forms air gaps, reducing coupling capacitance and propagation delays.
- Semiconductor Package Stacking for Signal Path Optimization
Direct package stacking eliminates interposers to shorten signal paths while reducing device complexity.
- Semiconductor Package Heat Spreader Direct Die Attachment
Chemical plasma etching exposes redistribution layer traces for direct heat spreader attachment, bypassing slow laser drilling and molding material barriers.
- Thermally Conductive Resin Sheet Mixed Filler Ratio
A thermosetting resin sheet combines flat and granular fillers at specific volume ratios to boost thermal conductivity while maintaining electrical insulation.
- Oxidized Barrier Metal Film Adhesion to Copper
A titanium oxide barrier film forms on copper interconnects using controlled oxidation.
- Dummy Pattern Layout for CMP Uniformity in Semiconductor Wafers
Strategic dummy pattern placement prevents over-polishing in low-density chip areas while maintaining film thickness reliability.
- Thermal Management of Electronic Components via Anisotropic Conductive Film
Anisotropic conductive film bonds a metal foil sheet to a circuit board frame, dissipating heat from miniaturized components without bulky cooling apparatus.
- Semiconductor Pad Layout for Uniform Heat Distribution
Extended pad regions retain heat at array ends to prevent short-circuits from dummy bumps, ensuring uniform thermal distribution.
- Pressure Body Sliding Layer for Thermal Stress Reduction
A pressure transmission apparatus uses a carbon-containing sliding layer to enable frictionless transverse motion during chip bonding.
- Semiconductor Chip Insulating Layer for Resin Permeation Prevention
A resin-permeation preventing insulating layer covers semiconductor chip surfaces to block resin flow during sealing.
- Electronic Device Warpage Reduction via Insulating Layer
An insulating layer separates conductors from components, reducing thermal warpage during high-temperature manufacturing processes.
- Stacked Imaging Device Pixel Architecture for Sensitivity Resolution Trade-off
A stacked imaging pixel architecture separates photodiodes and transistors across two semiconductor substrates to maximize light capture area.
- Composite Solder Ball with Barrier Layer for Reflow Integrity
Segmented solder balls prevent core deformation and electrical shorts by using a barrier layer with a higher melting point than the core.
- Semiconductor Module With Diffusion Soldering And Carrier Depressions
Diffusion soldering creates intermetallic phases between chips and carriers, reducing manufacturing complexity while improving electrical reliability.
- Sub-Lithographic IC Pattern With Offset Contact Areas
Offset portions in Y-direction portions define contact areas, resolving pitch reduction limits while maintaining vertical plug compatibility.
- Stacked Sheet Water-Cooling Radiator with Integrated Flow Guide
A stacked sheet water-cooling radiator unit integrates flow guide sections and circular conversion sinks to enhance heat exchange efficiency.
- Semiconductor Device Terminal Configuration via Segmentation
Segmented internal and external terminals allow flexible terminal orientation, resolving manufacturing restrictions that limit lead frame configurations.
- Semiconductor Package Step Structure for EMI Shield Burr Control
A semiconductor package step structure prevents electromagnetic shield material from forming continuous films on outer edges.
- Electrochemical Copper Deposition on Barrier Layers
A copper metallization process deposits seed layers directly onto barrier materials using electrochemical reactions in an oxygen-depleted environment.
- Flexible Die Embedding with Patterned Adhesion
Patterned adhesion on a flexible substrate enables die embedding, reducing chip breakage risk during assembly.
- POP IC Package Buffer Layer Thermal Conduction
A buffer layer facilitates thermal conduction between stacked integrated circuit packages in a package-on-package assembly.
- Underfill Material Copolymerization for Voidless Mounting
Acrylic maleimide underfill material copolymerizes to enable low-pressure mounting, preventing chip warping and solder flow during assembly.
- Semiconductor Package 3D Conductive Layers IR Drop Reduction
Stacked conductive layers with adhesive insulation reduce IR drop and noise in miniaturized semiconductor packages.
- Semiconductor Packaging Using Embedded Alignment Marks
A semiconductor packaging method uses embedded alignment marks to position devices within insulation layer cavities.