Semiconductor Module With Diffusion Soldering And Carrier Depressions
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Solution Overview
Problem
Current semiconductor module production methods face challenges in efficiently integrating semiconductor chips with carriers while ensuring reliable electrical connections and thermal management, particularly in achieving low contact resistance and flexible circuit integration.
Innovation Solution
The solution involves arranging semiconductor chips with contact elements on carriers, covering them with insulating and wiring layers, and using conductive adhesives or diffusion soldering to create intermetallic phases for electrical connectivity, along with optional depressions and films for heat dissipation and structural alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If die bonding or wire bonding methods are used to connect semiconductor chips to carriers, then electrical connections can be established, but contact resistance and manufacturing complexity increase
Solution Approach 1:
The patent extracts the intermediate bonding process (die bonding/wire bonding) and replaces it with a direct diffusion soldering connection between chip contact elements and carrier contact pads, eliminating the need for separate bonding layers and reducing manufacturing steps
Solution Approach 2:
The patent employs composite material structures including metal intermetallic phases formed through diffusion soldering, combining chip material, contact element material, and carrier material to create a multi-layer composite connection structure with optimized electrical and thermal properties
2Reliability
If conventional bonding methods are used, then chip-to-carrier connection is achieved, but thermal management efficiency decreases
Solution Approach 1:
The patent creates a composite material structure through diffusion soldering that forms metal intermetallic phases at the chip-carrier interface, providing both mechanical bonding and enhanced thermal conduction pathways for efficient heat dissipation
Solution Approach 2:
The patent replaces mechanical bonding methods (die bonding/wire bonding) with diffusion soldering that creates direct metallurgical bonds, improving thermal contact conductance by eliminating interface thermal resistance associated with bonding layers
3Ease of manufacture
If semiconductor chips are arranged on carriers without depressions, then assembly is simpler, but alignment precision and structural stability decrease
Solution Approach 1:
The patent introduces localized depressions in the carrier substrate at specific chip positions, creating local structural features that provide mechanical retention and precise alignment references without complicating the overall carrier structure or assembly process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable electrical contact with low resistance, flexible module integration, and effective heat dissipation, enhancing the performance and versatility of semiconductor modules.
Implementation Method 1
using conductive adhesives or diffusion soldering to create intermetallic phases for electrical connectivity
Implementation Method 2
The semiconductor chip is arranged on a carrier in such a way that the first main surface of the semiconductor chip faces the carrier
Data Source
AI summary
A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second main surface and the carrier.