Half-Bridge Package With Common Heat Sink for Thermal Dissipation
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Solution Overview
Problem
Existing power electronic switching systems are unsatisfactory in terms of size, constructive complexity, and thermal dissipation effectiveness due to the separate packaging and mounting of low-side and high-side transistors in switching systems.
Innovation Solution
Integrating both low-side and high-side transistors into a single package with a shared heat sink on the mounting surface for electrical connection, allowing for improved thermal dissipation and reduced size through a compact half-bridge configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If separate packages are used for low-side and high-side transistors, then electrical connection and thermal dissipation are achieved, but device size and constructive complexity increase
Solution Approach 1:
The patent combines two separate transistor packages (low-side and high-side transistors) into a single integrated package. The insulating body houses both transistor chips, with their respective heat sinks electrically connected through conductive paths within the same package structure. This merging reduces device complexity and size while maintaining reliable electrical connections through the integrated design.
2Reliability
If separate packages are used for low-side and high-side transistors, then electrical connection is achieved, but thermal dissipation effectiveness decreases
Solution Approach 1:
The patent integrates multiple heat sinks for different transistors into a single common heat sink structure. The heat sink is designed with multiple regions that can dissipate heat from various transistor chips simultaneously, improving thermal dissipation effectiveness. The unified heat sink design reduces the number of separate thermal management components while enhancing heat dissipation performance.
3Area of stationary object
If multiple separate packages are mounted on the printed circuit board, then electrical connections are established, but the mounting surface area increases
Solution Approach 1:
The patent consolidates multiple transistor packages into a single integrated package that houses both low-side and high-side transistors. This single package occupies less mounting surface area on the printed circuit board compared to multiple separate packages, while maintaining all necessary electrical connections through the integrated design.
4Reliability
If a common heat sink is used for multiple transistors, then thermal dissipation efficiency improves, but electrical insulation requirements increase
Solution Approach 1:
The patent uses an insulating body as an intermediary material that provides electrical insulation between different transistor chips while allowing thermal conduction to the common heat sink. The insulating body is positioned between the transistor chips and the heat sink, preventing electrical short circuits while maintaining efficient thermal dissipation pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size and complexity of the switching system while enhancing thermal dissipation efficiency, leading to improved performance and cost-effectiveness.
Implementation Method 1
the chip is fastened on the heat sink, so as to facilitate the transfer of the heat produced by it to the outside of the package (so as to reduce the thermal resistance of the electronic device from its chip to the external atmosphere)
Implementation Method 2
the package of every power electronic device is generally provided with a heat sink, which has a wide surface exposed on a surface for mounting the insulating body on the printed circuit board
Data Source
AI summary
A device includes a first switch and a second switch, each switch being integrated on a chip having a back surface and an opposite front surface. Each chip includes a first conduction terminal and a control terminal on the front surface, while a second conduction terminal of the switch is located on the back surface. The first switch and the second switch are connected in a half-bridge configuration with the first switch's second conduction terminal electrically connected to the second switch's first conduction terminal. The chips are installed in a common package comprising an insulating body with an embedded heat sink. The chips of the switches are mounted on the heat sink such that the second conduction terminal of the first switch and the first conduction terminal of the second switch are in contact with the heat sink, with the heat sink providing the electrical connection between the two switches.