Electronic Device Warpage Reduction via Insulating Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current electronic devices face structural reliability issues due to the mismatch in thermal expansion coefficients between substrates and conductive layers, leading to warpage during high-temperature processes.
Innovation Solution
The electronic device design includes a substrate with a first conductor layer, a first insulating layer, and an electronic component, where the electronic component is disposed on the insulating layer and coupled to the conductor layer, and the driving structure is coupled to the electronic component, thereby reducing warpage and improving structural reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the driving structure is fabricated directly on the substrate, then the manufacturing process is simplified, but the substrate warps due to thermal expansion mismatch during high-temperature processes
Solution Approach 1:
An intermediate layer is introduced between the substrate and the driving structure to act as a mediator. This intermediate layer has thermal expansion properties that bridge the gap between the substrate and the driving structure, preventing warpage during high-temperature manufacturing processes while allowing the structure to be fabricated on the substrate.
Solution Approach 2:
The patent employs composite material structures that combine multiple layers with different thermal expansion coefficients. By carefully selecting and combining materials with complementary thermal properties, the overall structure achieves thermal stability during manufacturing while maintaining the desired electrical and mechanical functions.
2Reliability
If the electronic component is disposed on the first insulating layer and coupled to the first conductor layer, then structural reliability is improved, but the device complexity increases
Solution Approach 1:
The device structure is segmented into distinct functional layers: the first conductor layer for electrical connectivity, the first insulating layer for electrical isolation, and the electronic component for functionality. This segmentation allows each layer to be optimized independently for its specific function while collectively achieving improved structural reliability.
Solution Approach 2:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked architecture. By arranging components in vertical layers rather than spreading them out horizontally, the design achieves better structural reliability and thermal management while efficiently utilizing the available space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the structural reliability of the electronic device by minimizing warpage caused by high-temperature processes, allowing for improved performance and durability.
Implementation Method 1
a first insulating layer, wherein the first insulating layer is disposed on the first conductor layer
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
The disclosure provides an electronic device, including a substrate, a first conductor layer, a first insulating layer, an electronic component, and a driving structure. The first conductor layer is arranged on the substrate. The first insulating layer is disposed on the first conductor layer. The electronic component is arranged on the first insulating layer and coupled to the first conductor layer. The driving structure is coupled to the electronic component. The electronic device in the disclosure can have improved structural reliability.