Semiconductor Device Terminal Configuration via Segmentation
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Solution Overview
Problem
Conventional semiconductor devices have limited freedom in designing external terminal configurations due to manufacturing restrictions associated with lead frames and molding dies, and existing solutions that provide separate external terminals require these terminals to project from the top surface, limiting their configuration, location, and orientation.
Innovation Solution
A semiconductor device with a functional block unit, internal and external terminals, and resin sealing bodies, where the external terminals are connected to the internal terminals and partially covered by an external resin sealing body, allowing for greater design flexibility and separate manufacturing of external terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If external terminals are separate components inserted into cylindrical connection members, then freedom in selecting external terminal configurations is increased, but external terminals must project from the top surface limiting their configuration, location, and orientation
Solution Approach 1:
The invention divides the terminal structure into internal terminals (integrated with the functional block) and external terminals (separate components). The external terminals are inserted into hollow internal terminals that extend from the resin sealing body, allowing the external terminals to be positioned at various locations including side surfaces rather than projecting only from the top surface. This segmentation enables greater configurational freedom while maintaining manufacturing feasibility.
Solution Approach 2:
The invention transitions from a conventional top-surface projection arrangement to a multi-dimensional terminal distribution. By allowing external terminals to be inserted into internal terminals that extend from side surfaces and other locations of the resin sealing body, the terminal arrangement moves from a single-plane (top surface) constraint to three-dimensional spatial distribution, enabling flexible positioning in various orientations and locations.
2Reliability
If external terminals project from the top surface to ensure insulation, then insulation is maintained, but the configuration, location, and orientation of external terminals are limited
Solution Approach 1:
The terminal system is segmented into internal terminals that provide structural support and insulation integration with the resin sealing body, and external terminals that provide electrical connection functionality. The internal terminals act as insulating housings that guide and position the external terminals, allowing external terminals to be located at side surfaces and various orientations while maintaining insulation through the resin-embedded internal terminal structure.
3Ease of manufacture
If lead frames and molding dies are used for manufacturing, then manufacturing is feasible, but freedom in designing external terminal configurations is limited by manufacturing restrictions
Solution Approach 1:
The invention separates the terminal functions into internal terminals (manufactured with the resin sealing body using conventional molding processes) and external terminals (separate components that can be independently designed and then inserted). This segmentation allows the majority of the device to be manufactured using conventional lead frame and molding die processes, while the external terminals can be customized with greater design freedom without requiring specialized manufacturing equipment.
Solution Approach 2:
The internal terminals are pre-formed as hollow structures embedded in the resin sealing body during the molding process. These pre-formed internal terminals serve as receptacles that guide the subsequent insertion of external terminals, enabling flexible external terminal configurations while maintaining a straightforward manufacturing sequence that relies on conventional molding techniques.
Data Source
AI summary
A semiconductor device includes a functional block unit, external terminals and, and an external resin sealing body. The functional block unit includes an internal resin sealing body having an edge and an opposite edgeb. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The external resin sealing body covers the root portion and a portion of the middle portion of the external terminal, but does not cover the terminal portion of the external terminal. The functional block unit and the external terminals and are integrally connected together and sealed by the external resin sealing body.