Chip Package Thermal Conductive Unit for Heat Dissipation
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Solution Overview
Problem
Miniaturization of electronic components in chip package modules leads to increased heat generation and limited heat dissipation, affecting operational efficiency due to the small size and high power computing processes.
Innovation Solution
An electronic device with a chip package module comprising a chip carrier substrate, a chip, a thermal conductive unit, and an encapsulant layer, where the thermal conductive unit has a higher thermal conductivity than the chip, and the encapsulant layer partially covers the thermal conductive unit to expose its surface for efficient heat dissipation, along with a thermal dissipating unit to absorb and dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the chip package module is miniaturized, then the electronic device becomes smaller and more versatile, but heat generation increases and heat dissipation becomes limited
Solution Approach 1:
The patent introduces a thermal conductive unit extending in the vertical dimension (thickness direction) beneath the chip, transitioning heat dissipation from a two-dimensional surface problem to a three-dimensional volumetric solution. This allows heat to be conducted away through the thickness direction, effectively increasing the heat dissipation pathway without increasing the planar footprint of the miniaturized device.
Solution Approach 2:
The thermal conductive unit acts as an intermediary between the heat-generating chip and the external environment. With thermal conductivity greater than the chip itself, it serves as an efficient heat transfer medium, conducting heat from the chip's second surface to external heat dissipation structures, thereby resolving the heat retention problem in miniaturized packages.
2Power
If the chip performs high power computing processes, then computational performance increases, but heat generation increases and operational efficiency decreases
Solution Approach 1:
The patent extracts the heat management function from the chip package structure by introducing a dedicated thermal conductive unit. This separate thermal management component handles heat removal independently, allowing the chip to focus on high-power computing while the thermal conductive unit manages the thermal byproduct, thereby maintaining operational efficiency during high-performance operations.
Solution Approach 2:
The thermal conductive unit serves as an intermediary heat transfer medium between the high-power chip and external dissipation structures. Its superior thermal conductivity enables efficient heat extraction, ensuring that high computational power does not lead to excessive heat retention that would compromise operational reliability and efficiency.
3Volume of moving object
If the size of the chip package module is reduced, then the heat dissipation surface area is limited, but heat generation increases
Solution Approach 1:
The patent resolves the surface area limitation by utilizing the vertical dimension. The thermal conductive unit extends beneath the chip in the thickness direction, creating heat dissipation pathways that do not consume additional planar surface area. This allows the device to maintain a miniaturized footprint while providing adequate heat dissipation capacity through three-dimensional thermal management.
Solution Approach 2:
The patent segments the heat dissipation function from the chip structure itself, placing a separate thermal conductive unit in the space beneath the chip. This segmentation allows efficient use of the vertical space for heat conduction without requiring additional horizontal surface area, effectively decoupling heat dissipation capacity from device footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat retention and enhances operational efficiency by facilitating efficient heat transfer and dissipation, ensuring optimal performance of the electronic device.
Implementation Method 1
The thermal conductive unit has a first thermal conductive surface connected to the second chip surface, and a second thermal conductive surface opposite to the first thermal conductive surface. The thermal conductive unit has a thermal conductivity greater than that of the chip.
Data Source
AI summary
An electronic device includes a chip package module which includes a chip carrier substrate, a chip, a thermal conductive unit, and an encapsulant laver. The chip is electrically connected to the chip carrier substrate. The thermal conductive unit has a first thermal conductive surface connected to the chip, and a second thermal conductive surface opposite to the first thermal conductive surface. The thermal conductive unit has a thermal conductivity greater than that of the chip. The encapsulant layer covers the chip and partially covers the thermal conductive unit in such a manner that the second thermal conductive surface is exposed from the encapsulant layer.