Chip Packaging Module with Exposed Sensor Input
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Solution Overview
Problem
Existing chip packaging methods risk damaging chips with sensors due to the complex mold process and gel casting, which limits their application to surfaces that can tolerate gel coverage, excluding most electrical, mechanical, and electromechanical sensors, and affects the chip's performance.
Innovation Solution
A chip-packaging module that includes a chip carrier with a buffer layer to mount the chip without direct contact, allowing the mold material to cover only the chip carrier and not the input portion, enabling the chip to remain partially exposed for signal reception, and using a gentle assembly process to avoid mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex mold process and gel casting are used to cover the chip, then the chip is protected, but the chip with sensors may be damaged or destroyed by the mold tool
Solution Approach 1:
The patent introduces a leadframe as an intermediary carrier between the mold tool and the chip. The mold material is applied to the leadframe first, creating a cavity structure that indirectly houses the chip, thereby preventing direct contact between the mold tool and the sensitive sensor chip surface
Solution Approach 2:
The patent performs preliminary actions by first forming the mold material cavity on the leadframe before placing the chip. This preliminary cavity formation allows the chip to be subsequently positioned and secured within the pre-formed protective structure without exposing it to mechanical stress from the mold tool
2Reliability
If the mold material covers the entire chip surface, then the chip is sealed and protected, but the sensor input portion cannot receive signals
Solution Approach 1:
The patent applies local quality by selectively covering only certain areas of the chip with mold material while leaving the sensor input portion exposed. The mold material forms a cavity that protects the chip body and electrical connections, while the sensor surface remains accessible for signal reception from the external environment
3Reliability
If gel casting is performed over the chip, then the chip is encapsulated, but bubbles are formed in the gel affecting performance
Solution Approach 1:
The leadframe serves as an intermediary substrate that supports the chip during the encapsulation process. The mold material is first formed on the leadframe creating a stable cavity structure, which then receives the chip. This two-stage process prevents gel casting directly over the chip, eliminating bubble formation while achieving complete encapsulation
4Reliability
If the mold tool is sealed directly on the chip, then the chip is protected, but the mold process becomes complicated and risks contaminating the mold tool
Solution Approach 1:
The leadframe acts as an intermediary carrier that simplifies the mold process. The mold tool seals against the leadframe rather than directly against the chip, reducing complexity and contamination risk. The leadframe serves as a robust platform for mold material application, while the chip remains protected within the resulting cavity structure
Data Source
AI summary
A chip-packaging module for a chip is provided, the chip-packaging module including a chip including a first chip side, wherein the first chip side includes an input portion configured to receive a signal; a chip carrier configured to be in electrical connection with the first chip side, wherein the chip is mounted to the chip carrier via the first chip side; and a mold material configured to cover the chip on at least the first chip side, wherein at least part of the input portion is released from the mold material.