Chip Resistor Matrix Network with Fuse Films for Resistance Tuning
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Solution Overview
Problem
Conventional chip resistors face limitations in accommodating a wide range of resistance values due to the deviation in resistive film resistance values during screen printing, requiring laser trimming to adjust resistance, which is inefficient for varied resistance requirements.
Innovation Solution
A chip resistor design featuring a substrate with a resistor network comprising multiple resistor bodies connected in series or parallel, utilizing fuse films to adjust resistance values without altering the basic design, allowing for easy incorporation or separation of resistance units to match various resistance values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If screen printing is used to form the resistive film, then the manufacturing process is simple and efficient, but the resistance value deviates from the target value requiring additional laser trimming
Solution Approach 1:
The resistive film is segmented into multiple resistor bodies arranged in a matrix pattern on the substrate. Each resistor body can be independently connected or disconnected through fuse films, allowing precise control of the total resistance value by selecting different combinations of resistor bodies in series or parallel configurations.
Solution Approach 2:
The resistance value is made dynamically adjustable through the fuse films that can be selectively broken to change the connection state of resistor bodies. This allows the resistance to be tuned from a fixed printed value to a range of precise values by controlling which resistor bodies are connected in series or parallel.
2Manufacturing precision
If laser trimming is performed to adjust the resistance value to the target value, then the resistance precision is improved, but the manufacturing complexity and time increase
Solution Approach 1:
Multiple resistor bodies are pre-formed in a matrix arrangement with fuse films connecting them in various configurations. This preliminary segmentation allows the resistance value to be adjusted by simply breaking specific fuse films rather than performing complex laser trimming of a single resistive film, simplifying the precision adjustment process.
3Device complexity
If a single resistive film is used, then the device structure is simple, but the range of accommodated resistance values is limited
Solution Approach 1:
The single resistive film is divided into multiple resistor bodies arranged in a matrix, where each resistor body has a base resistance value. By connecting these resistor bodies in series or parallel through fuse films, a wide range of resistance values can be achieved while maintaining a relatively simple overall structure on the substrate.
Solution Approach 2:
The same matrix arrangement of resistor bodies and fuse films can produce multiple different resistance values by changing the connection configuration. This universal structure serves multiple functions, accommodating various resistance requirements without needing different physical designs for each resistance value.
4Adaptability or versatility
If fuse films are used to connect or separate resistance units, then the resistance value adaptability is improved, but the device complexity increases
Solution Approach 1:
Multiple resistor bodies are merged into a unified matrix structure with shared fuse films that can connect different resistor bodies in series or parallel. This merging approach allows the same physical structure to achieve multiple resistance values through different connection states of the fuse films, reducing the need for separate structures for each resistance value.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of high-quality chip resistors with compact designs that can accommodate multiple resistance values by changing the connection mode of resistor bodies, allowing for precise adjustment of resistance values within a wide range without changing the basic design.
Implementation Method 1
a laser trimming of irradiating a laser beam to engrave a trimming groove in the resistive film is performed
Implementation Method 2
the plurality of fuse films electrically incorporating the corresponding resistance unit into the resistor network or being capable of being fused to electrically separate the corresponding resistance unit from the resistor network
Data Source
AI summary
A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.