Printed Circuit Assembling TRIZ Cases

Temperature gradients during solidification form pole-like intermetallic compounds that reinforce solder joints, reducing cracks under thermal stress.

A multi-width waveguide system segments signal traces to optimize dimensions for low loss transmission and integrated circuit coupling.

Lateral channels in soldering contacts vent waste gas during reflow, preventing cavity formation that degrades electrical and thermal coupling.

A semiconductor socket uses vertical contact members and additive conductive traces to redistribute terminal pitch.

A capacitor element mounting structure arranges ceramic capacitors perpendicularly to cancel vibrations.

Dead end regions in the connector housing trap intruding wires, resolving dimensional tolerance gaps between the case and housing.

A stamped grid positions resistors on switch blanks using recesses and aids.

A flexible wiring substrate incorporates a light-transmission window to visualize mold material distribution between overlapping substrates.

A harness with projecting housings directly connects two printed circuit boards through their fixing holes.

A substrate structure with narrower electrical contacts increases circuit density while maintaining bonding strength.

A film-type circuit uses pre-formed through-holes to enable precise alignment between flexible wiring and rigid printed circuit boards.

Segmenting the instruction screen across adjacent machine panels resolves the contradiction between compact device size and sufficient information visibility.

A vehicle lighting device uses a cover member to press down the substrate and an operation switch with a movement restricting portion.

Segmented orthogonal and angled illumination resolves contrast issues during inclined component mounting.

Polygon lands with circular concaves create pressure gradients that draw solder inward, preventing bridges without narrowing gaps or reducing wiring density.

Exposing via conductors at the bottom of a half-cut groove prevents lateral slipping and ensures reliable electrical connections with shield layers.

Partially cured dielectric material flows under heat and pressure to fill voids around embedded electronic components.

A non-metallic local reinforcing layer stabilizes substrate boards to ensure reliable integrated-circuit chip mounting.

Conductive ink shield regions absorb electromagnetic noise from inductors and power planes, reducing radiofrequency interference on nearby high-speed traces.

Capillary epoxy impregnation fills sub-micron voids between silvered piezo elements, reducing mechanical losses and preventing high voltage electric breakdown.

Additive printed electrical interconnect deposits conductive particles to form circuit geometry, reducing parasitic effects and enhancing current capacity.

Offset alignment marks on a flexible circuit board and substrate resolve recognition constraints, enabling narrower display frames.

Segmenting FPC bonding areas lowers debonding stress on flexible substrates, improving manufacturing yield for large-size carriers.

Simultaneous lamination cures prepreg and activates anisotropic conductive film, eliminating separate heating steps for reliable electrical connections.

A solderless socket pin uses a movable retention feature to securely engage surface mount modules without soldering.

Perpendicular terminals and resisting portions enable local laser fusing, ensuring consistent solder heights and reliable electrical conduction.

Retaining features on a carrier securely hold flexible substrates, resolving dimensional stability issues caused by coefficient of thermal expansion mismatch.

Liquid crystal polymer solder mask with aligned apertures prevents bridging and electrical shorting on closely spaced pads.

Standoff interposers create clearance between substrates to reduce mechanical stresses while maintaining high-density electrical connectivity.

A segmented multilayer printed circuit board uses module assembly to create conductive through-connections without deep drilling.

A dual printed circuit board approach slides inward to contact power amplifier terminals using pre-deposited solder balls for direct electrical connections.

A carrier plate with a 90-degree contact pad enables direct soldering of SMD components via conductive coating.

Controlled z-axis expansion and contraction in anisotropic conductive films prevents bubbling between electrodes while maintaining connection reliability.

Extracting the power regulator via a PCB cutout eliminates trace routing complexity and reduces power loss.

A chip resistor uses a matrix of resistor bodies and fuse films to adjust resistance values without altering the basic design.

Dot-scattering energy beam heating joins semiconductor elements to circuit contacts, reducing FR-4 warpage and increasing bond strength.

Dynamic base member repositions working heads to eliminate dead zones caused by adding components, ensuring uniform coating application.

A flexible circuit board embedded in a wearable fixing belt integrates electronic components and device body connections.

A flexible circuit board connects to a non-flexible component via a localized connection portion sealed by protection resin.

A molded acoustic chamber directs audio sound through a flexible substrate to an outer housing opening.

A movable board imaging camera shifts position along the head unit to capture board images without moving the entire assembly.

Stretch-releasable adhesive tape bonds flexible conductive traces to substrates, enabling repeated connection cycles without damaging electronic devices.

Flexible interconnecting zones enable rapid separation of rigid-flex printed circuit board working and non-working zones using a single machine.

Heating solid particles above their melting point and pressing them in a controlled nip prevents uncontrolled spreading, ensuring sharp pattern resolution.

Asymmetric interlayer resin insulation layers balance curing contraction in embedded component wiring boards.

A hybrid-integrated chip package couples optical and electrical circuits via a high-trace density interposer to enable multi-terabit per second communication.

A multilayer ceramic component uses copper external contacts bonded with glass frit to the stack.

A resist film bank contains conductive joint material during hot bar joining, preventing scattering and wet-spreading that causes short circuits.

Projected external terminals and segmented pads maximize wiring density while maintaining insulation reliability.