Stamped Grid Resistor Positioning for Switch Assembly
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Solution Overview
Problem
The production of electromechanical switches with integrated resistors faces challenges in precise positioning and attachment, particularly during the encapsulation process, where thermal expansion differences can lead to connection failures between switch blanks and resistors.
Innovation Solution
A method involving a stamped grid for positioning and attaching resistors directly onto the switch blank, eliminating the need for assembly robots and allowing for pre-positioning and simultaneous attachment and separation of resistors in a single work step, using recesses on the switch blank and positioning aids within the grid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If assembly robots are used to position and attach resistors to switch blanks, then positioning precision can be achieved, but device complexity and production cost increase
Solution Approach 1:
The stamped grid performs self-positioning through its own structural features (positioning aids, recesses) without requiring external assembly robots. The grid structure itself provides the positioning function that would otherwise require complex automated assembly equipment, thereby reducing device complexity while maintaining positioning precision.
Solution Approach 2:
The resistors are pre-positioned on the stamped grid before the actual assembly process. The stamped grid is prepared in advance with positioning aids and recesses that ensure correct resistor placement, eliminating the need for real-time positioning by assembly robots during the attachment process.
2Ease of manufacture
If resistors are attached to switch blanks before encapsulation, then integration is improved, but thermal expansion differences cause connection failures
Solution Approach 1:
The stamped grid provides localized mechanical support and constraint at the resistor attachment points through its recesses and positioning aids. This local structural quality compensates for the thermal expansion differences between materials during encapsulation, maintaining connection reliability while preserving the benefits of integrated manufacturing.
Solution Approach 2:
The stamped grid structure is designed to accommodate and compensate for thermal expansion stresses that will occur during encapsulation. The grid's mechanical properties and structural design provide beforehand cushioning against the thermal stresses, preventing connection failures before they occur.
3Manufacturing precision
If multiple work steps are used for pre-positioning and attaching resistors, then positioning accuracy is improved, but production time increases
Solution Approach 1:
The stamped grid combines multiple functions into a single integrated structure: it provides pre-positioning, mechanical support, and attachment functionality all in one component. This merging allows pre-positioning and attaching operations to be performed simultaneously in a single work step rather than as separate sequential operations, maintaining positioning accuracy while improving productivity.
Data Source
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AI summary
The method involves assembling a printed circuit board (2) with a component (5). Resistance measurement is accomplished between contact points (12) of the printed circuit board, after the assembly of the printed circuit board with the component, and before the continuation of the assembly of the printed circuit board with the components and/or further processing of the printed circuit board. The contact points are provided for contacting the components. Independent claims are also included for the following: (1) a device for assembling a printed circuit board with the components (2) an electromechanical switch with contacts for contacting the printed circuit board (3) a method for producing the component e.g. electromechanical switch (4) an arrangement for producing the component e.g. electromechanical switch.