High Frequency Module Via Conductor Exposure for Shielding
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Solution Overview
Problem
Existing methods for manufacturing high frequency modules face reliability issues due to the risk of via conductors slipping off during the half-cutting process and insufficient contact area between conductive shield layers and inner electrode layers, leading to reduced electrical connection reliability.
Innovation Solution
A method involving a collective substrate with via conductors penetrating through and exposed only at the bottom surface of a half-cut groove, ensuring stable connection with a conductive shield layer, and dividing the substrate to prevent slipping, while maximizing the thickness of via conductors for enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the collective substrate is half-cut to expose lateral surface of via conductor for connection with conductive shield layer, then contact area between via conductor and conductive shield layer is increased, but via conductor may slip off and fall into half-cut groove
Solution Approach 1:
The patent changes the exposure dimension of the via conductor from lateral surface (horizontal dimension) to bottom surface (vertical dimension). By forming the half-cut groove to expose only the bottom surface of the via conductor, the invention maintains electrical connection while preventing the via conductor from slipping off laterally into the groove.
Solution Approach 2:
The patent extracts only the necessary portion of the via conductor (bottom surface) for making electrical connection with the conductive shield layer, while leaving the lateral surfaces intact and embedded in the substrate. This selective exposure ensures connection reliability without compromising the structural stability of the via conductor.
2Reliability
If via conductor is exposed at lateral surface of half-cut groove to increase contact area, then electrical connection between conductive shield layer and via conductor is improved, but manufacturing precision is reduced due to risk of via conductor slipping
Solution Approach 1:
The invention shifts the exposure from lateral dimension to bottom surface dimension, creating a more stable manufacturing process where the via conductor's position is determined by the substrate structure rather than by precise control of lateral exposure, thereby improving manufacturing precision.
3Reliability
If via conductor thickness is increased to enhance reliability, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent segments the via conductor into two functional parts: the lateral surface portion remains embedded in the substrate for mechanical support and positioning, while only the bottom surface is exposed for electrical connection. This segmentation allows standard via conductor dimensions to be used while achieving high reliability through optimized geometry rather than increased size.
Data Source
AI summary
In a high frequency module, electronic components are mounted on a mounting surface of a collective substrate including a plurality of unit substrates that include a via conductor electrically conducted to a ground potential in a peripheral portion thereof, and the mounting surface and the electronic components are encapsulated with an encapsulation layer. The collective substrate is cut on the encapsulation layer side, thereby forming a half-cut groove penetrating through the encapsulation layer and extending halfway along the collective substrate in a thickness direction such that the via conductor is exposed only at a bottom surface of the half-cut groove. A conductive shield layer is formed to cover the encapsulation layer and is electrically conducted to the exposed via conductor. The collective substrate is then cut into individual unit substrates each including the conductive shield layer electrically conducted to the ground potential through the via conductor.