Power Regulator Cutout for PCB Power Delivery

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Solution Overview

Problem

As integrated circuit process nodes shrink, power supply noise increases due to decreasing power voltage, leading to inefficiencies in power delivery and potential thermal management issues.

Innovation Solution

A circuit system that directly connects a power regulator to the power terminals of an integrated circuit package via a cutout in the printed circuit board, allowing for efficient power delivery and improved thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If power regulators are distributed around the printed circuit board to provide power to the integrated circuit package, then power delivery is achieved, but power loss increases due to trace routing and the profile height increases

Engineering Contradiction:
Improvepower lossVSAvoidtrace routing complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The power regulator is extracted from the conventional distributed positioning around the PCB and repositioned directly onto the integrated circuit package. This extraction eliminates the need for trace routing across the PCB, thereby reducing power loss and simplifying the overall power delivery structure.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The power regulator transitions from a two-dimensional layout on the PCB surface to a three-dimensional configuration by mounting directly on the integrated circuit package. This dimensional change enables direct electrical connection through the package body, eliminating trace routing and reducing power loss.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If power regulators are distributed around the printed circuit board, then power supply is provided, but thermal management becomes more complex

Engineering Contradiction:
Improvethermal regulationVSAvoidthermal management complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The power regulator and integrated circuit package are merged into a single integrated structure where the power regulator is mounted directly on the package. This merging consolidates thermal management, allowing heat from both components to be dissipated through a unified thermal path, thereby simplifying thermal regulation.

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If conventional trace routing is used to connect power regulators to the integrated circuit package, then power delivery is achieved, but the number of power planes required increases

Engineering Contradiction:
Improvenumber of power planesVSAvoidpower loss
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The power delivery path is extracted from the conventional PCB trace routing system and reconfigured to connect the power regulator directly to the integrated circuit package terminals. This extraction eliminates the need for multiple power planes and trace routing, reducing both structural complexity and power loss.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS12225665B2Circuit system and method of manufacturing a printed circuit board
Publication Date: 2025.02.11 NVIDIA CORP
  • US12225665B2 patent drawing
  • US12225665B2 patent drawing
  • US12225665B2 patent drawing

AI summary

A circuit system and method of manufacturing a printed circuit board includes providing an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of side pins around a periphery of the cutout.