Narrow Electrical Contact Substrate for Semiconductor Package Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional flip-chip semiconductor packages face limitations in circuit density and bonding strength due to the width of electrical contacts, which restricts the miniaturization and performance of electronic products, and the ball on trace technology does not adequately address these issues.
Innovation Solution
The substrate structure features narrower electrical contacts compared to the circuits, allowing for increased pitches between adjacent contacts, improved bonding through conductive bumps, and simplified fabrication processes, while maintaining the width of the remaining circuit portions unchanged.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the electrical contact width is reduced to increase circuit density, then the circuit density is improved, but the bonding strength between the electrical contact and solder ball is reduced
Solution Approach 1:
The patent applies local quality by creating different width sections within the same circuit trace. The electrical contact portion has a narrower width optimized for high-density routing, while the solder ball bonding portion maintains a wider width to ensure adequate bonding strength. This local differentiation allows the circuit to simultaneously achieve high density in the routing area and strong bonding in the connection area, resolving the contradiction between circuit density and bonding strength.
2Length of moving object
If the circuit width is reduced to increase pitches between adjacent circuits, then the pitches are increased, but the circuit density is reduced
Solution Approach 1:
The patent implements local quality by varying the circuit width along its length. The section requiring close spacing (the electrical contact portion) is narrowed to enable smaller pitches and higher circuit density, while the bonding section maintains adequate width for reliable solder ball attachment. This localized width adjustment allows the circuit to achieve both small pitches for high density and sufficient bonding area for reliability.
3Strength
If the electrical contact width is maintained to ensure bonding strength, then the bonding strength is improved, but the circuit density is reduced
Solution Approach 1:
The patent resolves this contradiction by applying local quality through differential width design. The electrical contact portion is narrowed to maximize circuit density and enable fine-pitch routing, while a separate bonding portion is maintained at adequate width to ensure sufficient bonding strength with solder balls. This spatial separation of functions within the circuit trace allows both high density and strong bonding to coexist.
Solution Approach 2:
The patent applies segmentation by dividing the circuit trace into functionally distinct sections: a narrower electrical contact section for high-density routing and a wider bonding section for reliable solder attachment. This segmentation allows each portion to be optimized for its specific function, with the contact portion optimized for density and the bonding portion optimized for strength, thereby resolving the contradiction between these two requirements.
Data Source
AI summary
A substrate structure is provided, including a substrate body and a plurality of circuits formed on the substrate body. At least one of the circuits has an electrical contact for connecting to an external element and the electrical contact is narrower in width than the circuit, thereby meeting the requirements of fine line/fine pitch and miniaturization, improving the product yield and reducing the fabrication cost.