Segmented Multilayer PCB Through-Connection via Module Assembly
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Solution Overview
Problem
Current multilayer printed circuit boards (PCBs) require precise and costly deep drilling for through-connections, leading to increased size, weight, and manufacturing complexity, with sealing issues and air pockets forming during filler material introduction.
Innovation Solution
The solution involves combining two multilayer PCBs, where one forms the through-connection by being drilled through, eliminating the need for deep drilling and allowing for a stable, sealed, and miniaturized PCB with a conductive sleeve filled without air pockets, using a method that includes gluing and electroplating for efficient manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If deep drilling is used to create through-connections in multilayer PCBs, then electrical connectivity between layers is achieved, but the PCB dimensions and housing size increase
Solution Approach 1:
The invention divides the multilayer PCB into separate modules, each containing a subset of conductive layers. Through-connections are created within each module using standard drilling depths, eliminating the need for deep drilling across the entire stack. The modules are then connected via edge contacts, achieving the same electrical connectivity function without increasing overall PCB dimensions.
2Reliability
If deep drilling is used for through-connections, then electrical connectivity is established, but manufacturing complexity and cost increase
Solution Approach 1:
By segmenting the PCB into separate modules with standard drilling depths, the manufacturing process becomes simpler and more cost-effective. Each module can be manufactured using conventional drilling equipment without requiring special deep-drilling tools or extreme precision control, thereby reducing manufacturing complexity.
3Reliability
If deep drilling is used for through-connections, then electrical connectivity is achieved, but sealing quality deteriorates due to air pocket formation
Solution Approach 1:
Segmenting the PCB into separate modules allows for standard drilling depths that enable proper filler material insertion without air pocket formation. The shorter drill holes allow filler material to be pressed through cleanly, achieving reliable sealing and eliminating the air pocket issues associated with deep drilling.
4Reliability
If larger diameter sleeves are used for deep drilling, then through-connections can be formed, but PCB surface area and weight increase
Solution Approach 1:
By dividing the PCB into separate modules, the invention uses standard drilling depths that allow for smaller diameter sleeves. This segmentation approach eliminates the need for large-diameter sleeves required in deep drilling applications, thereby reducing the overall weight of the PCB while maintaining reliable through-connections within each module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and cost-reduces the manufacturing of PCBs, enabling miniaturization, reducing installation space, and ensuring reliable sealing and mounting, particularly beneficial for automotive applications like sensors and radar systems.
Implementation Method 1
in which an electrically conductive sleeve is formed
Data Source
AI summary
A printed circuit board is provided with multiple electrically conductive layers which are separated from each other by electrically non-conductive layers. At least one electrically conductive outer layer and multiple electrically conductive intermediate layers are provided. At least one electrically conductive through-connection is provided between an electrically conductive outer layer and an electrically conductive intermediate layer. The printed circuit board consists of at least one first multilayer PCB and one second multilayer PCB. The first multilayer PCB is formed from multiple electrically conductive layers and multiple electrically non-conductive layers, and the second multilayer PCB has at least one electrically conductive layer and at least one electrically non-conductive layer. The multilayer PCBs are connected to each other. The electrically conductive through-connection between a first electrically conductive outer layer and a second electrically conductive outer layer is formed from multilayer PCBs.