Solderless Socket Pin Retention Mechanism for Surface Mount Modules
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Solution Overview
Problem
Custom sockets for coupling modules to printed circuit boards (PCBs) are prohibitively expensive for commercial use, limiting their application in commercial products.
Innovation Solution
A solderless socket apparatus comprising a header pin assembly with an insulator and a first pin that includes a retention feature allowing for secure engagement and easy removal of surface mount modules without the need for solder, using a U-shaped design with a movable second portion that biases towards engagement and disengagement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spring loaded pins or pads with hold down mechanisms are used to couple modules to PCBs, then reliable electrical connection and module retention are achieved, but the socket becomes prohibitively expensive for commercial use
Solution Approach 1:
The socket is divided into individual header pin assemblies, each independently structured with an insulator and pin components. This segmentation allows for simpler, more cost-effective manufacturing compared to integrated spring-loaded mechanisms, while maintaining reliable electrical connections through the distributed pin structure.
Solution Approach 2:
The header pin assembly uses simple, inexpensive components (insulator and pin) that can be easily manufactured and replaced if needed. This approach substitutes expensive, complex spring-loaded mechanisms with affordable, straightforward structures that achieve the same functional goals at lower cost.
2Stability of the object's composition
If hold down mechanisms such as bars or latching devices are added to maintain engagement, then module retention is improved, but device complexity and cost increase
Solution Approach 1:
The retention function is merged into the header pin assembly itself through the retention feature on the pin, eliminating the need for separate hold-down mechanisms like bars or latching devices. This integration maintains module engagement stability while reducing overall device complexity.
Solution Approach 2:
The retention feature on the pin automatically engages with the module to maintain stable connection without requiring external hold-down mechanisms. The pin structure itself provides the retention function, eliminating the need for additional complexity.
3Ease of manufacture
If solderless socket design is used to reduce cost and complexity, then ease of manufacture is improved, but ensuring secure engagement without additional mechanisms becomes challenging
Solution Approach 1:
The pin is designed with a specific retention feature at a localized position that provides secure engagement. This local quality enhancement at the critical engagement point ensures reliability without requiring complex overall structure, maintaining manufacturing simplicity while achieving secure connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables secure electrical contact and easy removal of surface mount modules from PCBs without damage, reducing production costs by eliminating the need for additional hold-down mechanisms.
Implementation Method 1
The second portion is movable between a first position and a second position, wherein the second portion is biased toward the first position
Data Source
AI summary
In an example, a method includes aligning a pin of a surface mount module with a corresponding first pin of a header pin assembly of a socket assembly of a circuit board. The first pin includes a first portion configured to electrically couple to the circuit board. A second portion includes a retention feature configured to selectively retain the second portion in engagement with the pin of the surface mount module. The surface mount module is moved in a first direction toward the circuit board, wherein the pin of the surface mount module pushes against the second portion to move the second portion to a second position to allow the pin of the surface mount module to pass by the retention feature. The second portion is configured to move back toward a first position once the pin is moved past the retention feature to engage the pin.