Power Amplifier Mounting Using Dual PCB Sliding and Solder Balls
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Solution Overview
Problem
Current power amplifier solutions face cost, yield, and reliability issues due to complex and costly custom-built printed circuit boards with metal coins, which complicate manufacturing and impact performance, while standard PCBs lack adequate performance without these coins.
Innovation Solution
The method involves sliding and mounting a power amplifier assembly with an extended heat slug onto a printed circuit board using a dual PCB approach, where the PCBs encompass the PA assembly, with pre-deposited solder and specific contact areas to achieve high-quality electrical and thermal connections, eliminating the need for metal coins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PCB coins are used to enable pseudo-SMT manufacturing for power amplifier components, then adequate PA performance is achieved, but PCB manufacturing becomes difficult, lengthy and costly
Solution Approach 1:
The patent removes the metal coin component from the PCB assembly, extracting the problematic element that caused manufacturing complexity while maintaining the essential electrical connection function through alternative means (solder balls directly on PCB pads)
Solution Approach 2:
The invention replaces the expensive, complex metal coin structure with a simpler, more economical approach using standard PCB soldering techniques, accepting that the connection is made through a straightforward solder joint rather than a reusable coin component
2Reliability
If PCB coins are used to provide surface plane for PA mounting, then PA performance is adequate, but manufacturing cycle time increases
Solution Approach 1:
The PCB is prepared in advance with pre-formed solder balls on the contact pads during standard PCB manufacturing, eliminating the need for subsequent coin fabrication and attachment steps, thereby reducing overall manufacturing cycle time while maintaining connection quality
3Reliability
If PCB coins are used to create cavity plating for RF connection, then electrical connection quality is improved, but manufacturing cost increases
Solution Approach 1:
The metal coin component that required complex cavity plating is removed entirely, replacing it with direct solder ball connections to PCB pads, thereby eliminating the need for expensive cavity plating processes while maintaining adequate electrical connection quality for RF signals
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and cycle time, enhances PA performance with ideal electrical and thermal connections, and improves repeatability, achieving superior performance at a lower cost compared to existing solutions.
Implementation Method 1
The heat slug 5 is a clad or composite metal material to match thermal expansion and to improve thermal/electrical conductivity to the PA semiconductor die
Implementation Method 2
The source 3 has an electrical connection between the base of the PA module 4 and heat slug 5
Implementation Method 3
the pre-depositing of solder includes electro-depositing the solder during a PCB manufacturing process
Data Source
AI summary
Methods for mounting a power amplifier (PA) assembly having an extended heat slug (11) are disclosed. According to one aspect, a method includes manufacturing a left side PCB (22a) and a right side PCB (22b). The method further includes sliding the left side PCB and the right side PCB inward (30) to encompass the PA assembly so that one of the left and right side PCB is in a position to contact a drain of the PA (13) and so that the other of the left and right side PCB is in a position to contact a gate of the PA (14).