Semiconductor Socket With Vertical Contact Members and Additive Traces
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Solution Overview
Problem
Traditional semiconductor sockets face mechanical and electrical limitations, particularly with increased terminal count and reduced terminal pitch, leading to parasitic effects and signal integrity issues, which are exacerbated by the need for reflow soldering and complex contact member retention features, limiting their performance in next-generation systems operating above 5 GHz.
Innovation Solution
A semiconductor socket design featuring a substrate with discrete contact members and conductive traces, where the contact members lack retention features to reduce parasitic effects, and conductive traces are formed using additive printing processes to enhance electrical and mechanical performance, allowing for fine pitch connections and integration of passive and active circuit features without the need for reflow soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact members include retention features (springs, clips) to secure contacts, then mechanical reliability is improved, but parasitic effects increase and electrical performance deteriorates
Solution Approach 1:
The patent removes retention features (springs, clips, retention tabs) from contact members, extracting the harmful parasitic elements while maintaining mechanical reliability through alternative means such as interference fits and molded retention structures in the substrate
Solution Approach 2:
The contact member is segmented into distinct functional zones: a distal contact zone for electrical connection, a transitional zone for mechanical support, and a proximal retention zone integrated with the substrate. This segmentation allows each zone to optimize its function without compromising the others
2Quantity of substance
If terminal pitch is reduced to increase terminal count, then device density is improved, but contact spacing is reduced limiting spring deflection and increasing cross talk
Solution Approach 1:
The patent transitions from traditional planar contact arrangements to a three-dimensional substrate-based structure with contacts extending vertically through the substrate thickness. This dimensional change allows fine pitch connections while maintaining adequate contact member length for mechanical compliance and electrical performance
Solution Approach 2:
Contact members are nested within recesses or cavities in the substrate, with distal portions extending above the substrate surface. This nesting approach allows compact packaging of multiple contacts at fine pitch while providing structural support and electrical isolation
3Strength
If reflow soldering is used to attach socket to PCB, then mechanical connection is improved, but thermal stress and warping increase
Solution Approach 1:
The patent replaces the traditional reflow soldering process with a mechanical insertion and retention system. The socket assembly is attached to the PCB through mechanical means such as through-hole mounting, surface mount adhesive, or mechanical interlocks, eliminating the need for high-temperature reflow soldering and associated thermal stress
Data Source
AI summary
A semiconductor socket including a substrate with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete contact members are located in the plurality of the through holes. The plurality of contact members each include a proximal end accessible from the second surface, and a distal end extending above the first surface. At least one dielectric layer is bonded to the second surface of the substrate with recesses corresponding to target circuit geometry. A conductive material deposited in at least a portion of the recesses to form conductive traces redistributing terminal pitch of the proximal ends of the contact members.