Embedded Electronic Component Gap Elimination via Partially Cured Dielectric Flow
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Solution Overview
Problem
Existing methods for forming embedded electronic components often result in air gaps between the substrate and the electronic component, which can lead to inefficient signal routing and thermal management, and require complex processes to fill these gaps with dielectric material.
Innovation Solution
A method involving a substrate with patterned conductive layers and partially cured dielectric material is used, where the electronic component is placed in openings within the substrate, and pressure and heat are applied to fill the gaps with the dielectric material, forming an embedded electronic component with embedded conductive layers and a bottom filler material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor die is placed in an opening of a dielectric layer and the space is filled with dielectric material, then the electronic component is embedded in the substrate, but air gaps form between the substrate and electronic component leading to inefficient signal routing and thermal management
Solution Approach 1:
The patent applies preliminary action by using a partially cured dielectric material that is applied over the semiconductor die before final curing. This partially cured material flows to fill air gaps between the substrate and the die during the curing process, preventing harmful air gaps from forming and ensuring efficient signal routing and thermal management pathways are established in advance.
Solution Approach 2:
The patent utilizes parameter changes by transitioning the dielectric material from a partially cured liquid state to a fully cured solid state. During the curing process, the material's viscosity decreases allowing it to flow and fill air gaps, then upon curing, it solidifies to provide structural support while eliminating the harmful air gaps that would otherwise impede signal routing and thermal management.
2Reliability
If dielectric material is used to fill the space surrounding the semiconductor die, then the component is encapsulated, but complex processes are required to fill gaps with dielectric material
Solution Approach 1:
The patent simplifies the encapsulation process by utilizing the parameter change of the dielectric material from partially cured (liquid-like) to fully cured (solid). This phase transition allows the material to naturally flow and fill all gaps and voids around the semiconductor die during curing, eliminating the need for complex manual or mechanical filling processes while ensuring complete encapsulation and high reliability.
3Strength
If adhesive material is applied between substrate sidewalls and die, then support is provided during wire bonding and encapsulation, but the process requires additional material application steps
Solution Approach 1:
The patent merges the adhesive function with the dielectric encapsulation material. The partially cured dielectric material serves dual purposes: it acts as the encapsulation medium that fills all spaces around the die, and simultaneously provides adhesive support during wire bonding and encapsulation processes. This consolidation eliminates the need for separate adhesive application steps while maintaining the required structural support.
Solution Approach 2:
The dielectric material is designed to perform multiple functions: encapsulation, gap filling, adhesive support during wire bonding, and thermal management. By making the dielectric material multi-functional, the patent eliminates the need for separate adhesive materials and application steps, reducing process complexity while maintaining all necessary functions including die support during critical manufacturing stages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the formation of embedded electronic components with optimal signal routing and thermal management by eliminating air gaps and enabling a more even reflow of dielectric material, improving the structural integrity and performance of the packaged device.
Implementation Method 1
During the curing process where pressure and heat are applied to the layer stack, material of the partially cured dielectric layer flows for filling gaps within the first and second openings and becomes fully cured
Implementation Method 2
During the curing process where pressure and heat are applied to the layer stack
Implementation Method 3
During the curing process where pressure and heat are applied to the layer stack
Data Source
AI summary
Forming an embedded electronic component includes attaching an electronic component to a first conductive layer and forming a layer stack with a first partially cured dielectric layer having a first opening and a substrate having a second opening. The partially cured dielectric layer is located over the first conductive layer and the substrate is located over the first partially cured dielectric layer such that the first and second openings surround the electronic component. Heat and pressure are applied to the layer stack such that the first partially cured dielectric layer flows for filling gaps within the first and second openings and becomes fully cured.