Flexible Circuit Board Mounting Structure for Curved Surfaces

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Solution Overview

Problem

Existing mounting structures for wearable electronic devices on curved surfaces face issues with connection portion protection from moisture and dust, leading to wearing instability and user discomfort due to non-flexible regions that do not conform to the curved surface.

Innovation Solution

A mounting structure that includes a flexible circuit board, a non-flexible component, and connection portions with a protection resin that seals only the connection area, allowing the flexible circuit board to be bent and protecting it from moisture and dust, while reducing the non-flexible region size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the entire surface of the non-flexible printed substrate is filled with under-fill to protect connection portions, then the connection portions are protected from moisture and dust, but a large non-flexible region is formed that does not conform to the curved surface, causing wearing instability and user discomfort

Engineering Contradiction:
Improveprotection of connection portionsVSAvoidconformity to curved surface
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies under-fill material selectively only in the connection portion region where electrodes connect the flexible and non-flexible substrates, rather than filling the entire non-flexible substrate surface. This localized application protects the connection portions from moisture and dust while leaving the rest of the flexible substrate surface free to conform to curved surfaces, thus resolving the contradiction between connection protection and surface conformity.

Inventive Principle:
Principle #3Local quality

2Device complexity

If connection portions are left exposed to simplify the structure, then the device structure is simpler, but the connection portions are vulnerable to moisture and dust, reducing reliability

Engineering Contradiction:
Improvestructure simplicityVSAvoidprotection from moisture and dust
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent introduces under-fill material specifically in the connection portion area to provide protective functions (moisture and dust resistance) without requiring complete enclosure or complex sealing structures. This localized protection approach maintains relative structural simplicity while significantly improving the reliability of connection portions against environmental factors.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11304295B2Mounting structure and electronic device
Publication Date: 2022.04.12 NEC CORP
  • US11304295B2 patent drawing
  • US11304295B2 patent drawing
  • US11304295B2 patent drawing

AI summary

In order to provide a mounting structure that has high reliability and easily follows a curved surface, the mounting structure includes a flexible circuit board, a non-flexible component, and a connection portion that is provided in a region smaller than a bottom surface of the non-flexible component and connects the flexible circuit board and the non-flexible component to each other. Further, a protection resin that seals the connection portion in such a way that the flexible circuit board and the non-flexible component are separable from each other outside of the connection portion, is provided. In this configuration, the protection resin covers only a region provided with the connection portion. Thus, the connection portion is mechanically reinforced by the protection resin, and is protected from moisture and dust. Further, on an outside of the connection portion, the flexible circuit board can be bent.