Flexible Substrate FPC Bonding Area Segmentation
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Solution Overview
Problem
The current process of manufacturing flexible electronic components faces challenges with high debonding stress during the removal of substrates from carriers, leading to reduced yield and difficulties in producing multiple flexible components on large-size carriers.
Innovation Solution
The solution involves a flexible electronic device design with a first and second flexible substrate, electronic components, and an adhesive layer, where the flexible printed circuits (FPCs) are bonded outside the adhesive layer, and the substrates are removed from carriers after the adhesive layer is exposed, reducing stress and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the substrate is removed from the carrier after bonding, then the flexible electronic component can be manufactured, but high debonding stress occurs on the bonding area due to structural stiffness increase, reducing manufacturing yield
Solution Approach 1:
The bonding area is segmented into a first bonding area and a second bonding area, with the first bonding area having reduced structural stiffness compared to the second bonding area. This segmentation allows the first bonding area to better withstand debonding stress during substrate removal while the second bonding area maintains sufficient stiffness for component functionality.
Solution Approach 2:
Different regions of the bonding area are given different structural stiffness properties. The first bonding area is designed with lower stiffness to reduce stress concentration during substrate removal, while the second bonding area maintains higher stiffness to ensure proper component operation. This local differentiation of mechanical properties resolves the contradiction between ease of manufacture and strength.
2Productivity
If multiple flexible components are manufactured on a large size carrier, then production efficiency increases, but the structural stiffness increase causes high debonding force making substrate removal difficult
Solution Approach 1:
The bonding area is divided into first and second bonding areas with different stiffness characteristics. The first bonding area's reduced stiffness enables easier substrate removal from large carriers while maintaining the ability to produce multiple components simultaneously, thus improving productivity without sacrificing ease of operation.
Solution Approach 2:
The structural stiffness parameter is changed in the first bonding area to be lower than in the second bonding area. This parameter modification allows the bonding area to flex during substrate removal from large carriers, reducing debonding force and making the process easier to operate while maintaining high production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the failure rate of manufacturing flexible electronic devices by minimizing stress on FPC bonding areas, allowing for more efficient production of large-size flexible components.
Implementation Method 1
an adhesive layer, wherein the adhesive layer is disposed between the first surface of the first flexible substrate and the first surface of the second flexible substrate
Data Source
AI summary
A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.