Embedded PCB Component Bonding via Simultaneous Lamination
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Solution Overview
Problem
The existing methods for embedding electronic components in printed circuit boards using Anisotropic Conductive Films require a separate step of heat and pressure application, which is costly and undesirable, adding to production costs and complexity.
Innovation Solution
A semi-finished product is developed where both the Anisotropic Conductive Film and prepreg material are in an unprocessed state, allowing for simultaneous processing during the lamination step, eliminating the need for a dedicated heating and pressure step for the Anisotropic Conductive Film, and ensuring reliable connectivity and mechanical stability in a single step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate heat and pressure step is applied to process the Anisotropic Conductive Film, then reliable electrical connection is achieved, but production cost and process complexity increase
Solution Approach 1:
The patent combines the processing of the Anisotropic Conductive Film with the lamination process of the prepreg material into a single step. The heat and pressure applied during lamination simultaneously cure the prepreg and activate the Anisotropic Conductive Film, eliminating the need for a separate processing step and reducing overall process complexity while maintaining connection reliability
Solution Approach 2:
The lamination process is given multiple functions: it both cures the prepreg material to form structural insulating layers and processes the Anisotropic Conductive Film to establish electrical connections. This multi-functionality reduces the total number of production steps required
2Reliability
If a separate heat and pressure step is applied to process the Anisotropic Conductive Film, then proper compression and conductivity are achieved, but production time and cost increase
Solution Approach 1:
The patent merges the Anisotropic Conductive Film processing with the prepreg lamination step, so that the heat and pressure application occurs simultaneously for both materials. This integration eliminates the sequential time required for separate processing steps, reducing total production time while ensuring proper film activation
Solution Approach 2:
The Anisotropic Conductive Film is positioned and prepared in advance during the assembly stage, so that when heat and pressure are applied during lamination, the film is already in the correct position and configuration to be activated immediately, eliminating the need for additional positioning or processing time
3Ease of manufacture
If the Anisotropic Conductive Film is kept in unprocessed state during assembly, then flexibility in positioning is maintained, but additional processing step is required
Solution Approach 1:
The patent combines the advantage of keeping the Anisotropic Conductive Film in unprocessed state during assembly (maintaining positioning flexibility) with the benefit of eliminating separate processing steps by integrating film activation into the lamination process itself
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and maintains high-quality printed circuit boards by integrating electronic components connected via Anisotropic Conductive Films without additional heating and pressure steps, ensuring reliable conductivity and mechanical stability.
Implementation Method 1
bonded together by hardening panels of glass fibres impregnated with organic resin... which are delivered and processed in an uncured, hence viscous state of the organic resin. The actual insulating layer of the printed circuit board results when the organic resin has cured.
Implementation Method 2
It is only upon the application of pressure and heat that the Anisotropic Conductive Film is compressed so that in the areas where the pads or pins of the electronic component compress the film and the coated beads or spheres so that the beads or spheres contact each other, thereby forming conductive bridges
Implementation Method 3
application of pressure and heat that the Anisotropic Conductive Film is compressed
Data Source
Figure 1~2
Figure 3~4
Figure 5a~5e
AI summary
In a semi-finished product (1) for the production of a printed circuit board, the semi-finished product (1) comprising a plurality of insulating layers (3) of a prepreg material and conductive layers (2, 2') of a conductive material and further comprising at least one electronic component (4) embedded in at least one insulating layer (3) the at least one electronic component (4) is attached to a corresponding conductive layer (2) by the aid of an Anisotropic Conductive Film (6) and the Anisotropic Conductive Film (6) as well as the prepreg material are in an unprocessed state. The method for producing a printed circuit board comprises the following steps: Providing at least one conductive layer (2), Applying an Anisotropic Conductive Film (6) on the conductive layer (2), Affixing at least one electronic component (4) on the Anisotropic Conductive Film (6), Embedding the electronic component (4) in at least one insulating layer (3) of prepreg material to obtain a semi-finished product (1), Laminating the semi-finished product (1) to process the prepreg material and the Anisotropic Conductive Film (6).