Flexible Wiring Substrate Light-Transmission Window for Mold Material Verification

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Solution Overview

Problem

In electro-optical devices, it is challenging to confirm if the non-cured mold material is appropriately provided between flexible wiring substrates due to blocking by wiring lines and protective layers, making it difficult to ensure proper sealing and coupling.

Innovation Solution

Incorporating light-transmission windows in the wiring substrates where the wiring lines and protective layers are not present, allowing visualization of the mold material's spread and ensuring it reaches the necessary areas for effective sealing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protective layer is provided to cover wiring lines in flexible wiring substrates, then the wiring lines are protected, but the mold material application process becomes difficult to monitor visually

Engineering Contradiction:
Improveprotection of wiring linesVSAvoidvisual confirmation of mold material
Core Design Contradiction:
ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

The flexible wiring substrate is divided into two distinct regions: a first region with the protective layer covering wiring lines, and a second region without the protective layer. This segmentation allows the substrate to simultaneously provide protection where needed and visual access where required for monitoring mold material application.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The protective layer is selectively applied only to specific regions of the flexible wiring substrate where wiring lines require protection, while leaving other regions uncovered. This local quality approach ensures that protection is provided exactly where needed without compromising the ability to visually monitor mold material in uncovered areas.

Inventive Principle:
Principle #3Local quality

2Reliability

If the mold material is applied between overlapping wiring substrates, then sealing is achieved, but it becomes impossible to confirm proper material distribution

Engineering Contradiction:
Improvesealing between substratesVSAvoidvisibility of mold material spread
Core Design Contradiction:
ReliabilityVSLoss of information

Solution Approach 1:

The flexible wiring substrate is segmented into a first region with protective layer and a second region without protective layer. The second region acts as a visual inspection area that allows confirmation of mold material distribution while maintaining sealing functionality in the first region.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The second region of the flexible wiring substrate serves as an intermediary visual inspection area between the overlapping substrates. It allows light to pass through so that mold material distribution can be confirmed without compromising the sealing function provided by the overlapping structure and mold material.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If wiring lines and protective layers are provided across the entire flexible wiring substrate, then comprehensive protection is achieved, but mold material application cannot be visually verified

Engineering Contradiction:
Improvecomprehensive protection of wiringVSAvoidmonitoring of mold material application
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The flexible wiring substrate is divided into a first region where wiring lines are covered by protective layer for comprehensive protection, and a second region where no protective layer is provided to enable visual monitoring of mold material application.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The protective layer is applied with local quality - covering wiring lines in the first region for protection while being absent in the second region to provide visual access. This localized approach balances protection needs with operational monitoring requirements.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10908442B1Electro-optical device and electronic apparatus
Publication Date: 2021.02.02 SEIKO EPSON CORP
  • US10908442B1 patent drawing
  • US10908442B1 patent drawing
  • US10908442B1 patent drawing

AI summary

In an electro-optical device, a flexible first wiring substrate and a flexible second wiring substrate, which are respectively coupled to a first terminal region and a second terminal region, extend while overlapping with each other, and a first mold material is provided between the first wiring substrate and the second wiring substrate. The second wiring substrate includes a base film having transmissivity, a wiring line provided at the base film, and a protective layer that covers the wiring line and is less transmissive than the base film. In the second wiring substrate, a light-transmission window in which the wiring line and the protective layer are not present in part is provided in a region thereof overlapping with the first mold material.