Chip-Scale Electrochemical Sensor Wafer-Level Packaging

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Solution Overview

Problem

Conventional electrochemical sensors for detecting low-density gases face challenges such as large size, slow stabilization, low signal-to-noise ratio, and temperature limitations, which hinder their miniaturization and integration into compact, low-power devices for real-time air quality monitoring.

Innovation Solution

A chip-scale electrochemical sensing device is developed using wafer-level packaging techniques, featuring a base wafer with through vias for gas communication and integrated circuitry, allowing for compact, efficient, and cost-effective production of sensors that can detect gases with improved signal quality and temperature resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional electrochemical sensors are used, then gas detection function is achieved, but device size is large and stabilization time is long

Engineering Contradiction:
Improvesensor sizeVSAvoidstabilization time
Core Design Contradiction:
Volume of moving objectVSLoss of time

Solution Approach 1:

The sensor is divided into discrete functional layers (electrode layer, electrolyte layer, separator layer, contact layer) that can be manufactured separately and assembled. This segmentation enables miniaturization while maintaining proper function of each component, reducing overall sensor size without compromising stabilization performance

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from conventional planar sensor design to a three-dimensional stacked layered architecture. By stacking functional layers vertically, the sensor achieves compact footprint while maintaining adequate electrolyte volume and electrode surface area, thus reducing device size without extending stabilization time

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If conventional electrochemical sensors are used, then gas detection is possible, but signal to noise ratio is low

Engineering Contradiction:
Improvesignal to noise ratioVSAvoidsensor structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates metal trace elements from the sensor structure that cause RF coupling and signal losses. By removing these harmful metallic components and replacing them with non-conductive or minimally conductive materials, the signal-to-noise ratio is improved without adding significant structural complexity

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces an intermediary contact layer that electrically connects the electrolyte to external circuitry without using traditional metal traces. This intermediary structure reduces RF coupling and signal losses, improving measurement precision while maintaining manageable device complexity

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If conventional electrochemical sensors are used, then gas detection function is achieved, but temperature resistance is limited

Engineering Contradiction:
Improvetemperature resistanceVSAvoidmanufacturing process
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent changes the material parameters of the electrolyte and sealing components to withstand higher temperatures. By selecting materials with appropriate thermal stability and adjusting operational temperature parameters, the sensor achieves enhanced temperature resistance while remaining manufacturable through modified but feasible processes

Inventive Principle:
Principle #35Parameter changes

4Volume of moving object

If conventional electrochemical sensors are used, then gas detection is possible, but integration into compact devices is difficult

Engineering Contradiction:
Improvedevice form factorVSAvoidintegration capability
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The sensor is segmented into standardized functional layers that can be independently manufactured and then assembled into various configurations. This segmentation enables the sensor to be integrated into different compact device form factors while maintaining detection functionality

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The layered architecture and standardized interfaces enable the sensor to serve multiple functions and be adapted to various applications. The universal design allows integration into different compact devices while maintaining gas detection capability

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the creation of compact, low-power, and cost-effective electrochemical sensors that can efficiently detect gases in real-time, overcoming the limitations of conventional sensors by providing faster stabilization and improved signal quality while withstanding higher temperatures.

Implementation Method 1

a gas port through via in any of said cap and base wafers... providing gas coupling between the working electrode and the external environment

Methodology Applied
Scientific EffectDiffusion: Diffusion

Implementation Method 2

an electrochemical sensor responsive to a property of said gas, disposed in said sensor chamber; the electrochemical sensor comprising a first electrode and a second electrode, wherein the first and second electrodes coupled by an electrolyte

Methodology Applied
Scientific EffectElectrochemical reaction: Electrolysis

Data Source

PatentUS11054383B2Chip-scale sensing device for low density material
Publication Date: 2021.07.06 QUALCOMM INC
  • US11054383B2 patent drawing
  • US11054383B2 patent drawing
  • US11054383B2 patent drawing

AI summary

An electrochemical sensor device that is efficiently and economically produced at the chip level for a variety of applications is disclosed. In some aspects, the device is made on or using a wafer technology whereby a sensor chamber is created by said wafer and a gas port allows for a working electrode of the sensor to detect certain gases. Large scale production is possible using wafer technology where individual sensors are produced from one or more common wafers. Integrated circuits are made in or on the wafers in an integrated way so that the wafers provide the substrate for the integrated circuitry and interconnects as well as providing the definition of the chambers in which the gas sensors are disposed.