Chip Transfer Using Breakable Mechanical Fasteners
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Solution Overview
Problem
The existing methods for transferring elementary chips from a source substrate to a destination substrate face challenges in accurately controlling the bonding energy between the chips and the source substrate, particularly when the pitch of the chips needs to be adjusted, leading to difficulties in maintaining chips in place during positioning and separating them correctly.
Innovation Solution
The use of breakable mechanical fasteners that are entirely or partly located under each chip, allowing for precise control of the bonding energy and enabling efficient transfer by suspending the chips above the source substrate, which maximizes surface density and facilitates selective separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If bonding energy between chips and source substrate is increased to maintain chips in place during positioning, then chip stability during transfer is improved, but chip separation from source substrate after transfer becomes difficult
Solution Approach 1:
The bonding interface is segmented into two distinct mechanisms: initial strong bonding during transfer positioning, and controlled release through selective etching of sacrificial layers. This segmentation allows the system to achieve both stable positioning and easy separation by operating at different stages of the process.
Solution Approach 2:
Sacrificial layers are pre-formed between the chips and source substrate before the transfer process. These preliminary structures enable controlled separation later by being selectively removed through etching, allowing chips to be released without requiring high bonding energy in the first place.
2Quantity of substance
If pitch of elementary chips on source substrate is reduced to increase surface density, then manufacturing efficiency is improved, but positioning precision during transfer deteriorates
Solution Approach 1:
The source substrate acts as an intermediary carrier that temporarily holds chips at high density during manufacturing. The breakable fasteners and sacrificial layers serve as intermediary bonding mechanisms that enable precise positioning during transfer while maintaining the ability to release chips at the destination substrate regardless of their initial density on the source substrate.
3Adaptability or versatility
If intermediate transfer substrate is used to transfer chips, then transfer flexibility is improved, but device complexity and risk of layer degradation increase
Solution Approach 1:
The intermediate transfer substrate is extracted from the transfer process. Instead of using a separate intermediary substrate, the invention enables direct transfer from source substrate to destination substrate through controlled bonding and release mechanisms, thereby simplifying the overall device structure and reducing the risk of layer degradation while maintaining transfer flexibility.
Data Source
AI summary
A device for the transfer of chips from a source substrate onto a destination substrate, including: a source substrate having a lower surface and an upper surface; and a plurality of elementary chips arranged on the upper surface of the source substrate, wherein each elementary chip is suspended above the source substrate by at least one breakable mechanical fastener, said at least one breakable mechanical fastener having a lower surface fastened to the upper surface of the source substrate and an upper surface fastened to the lower surface of the chip.