Solid-State Devices TRIZ Cases

An asymmetric reflective sidewall adjusts the light forwarding angle of a light emitting device package to customize optical distribution.

Segmented lifetime control regions manage carrier lifetime in the drift region, suppressing leak current while reducing turn-off power loss.

Carbon ion implantation forms silicon carbide to generate tensile stress, narrowing the threshold voltage distribution and reducing window loss.

Scribing a ceramic substrate enables push-splitting of high-elasticity silicone resin, reducing tool wear during mass production.

A protection film extends along the side surface of a three-dimensional electrode structure with a shorter length than the structure itself.

Third stack electrically segments word lines to lower resistance and improve electrical characteristics without complex processing.

Vertical bit lines and word lines in a 3D array isolate active planes to reduce leakage currents, eliminating the need for series diodes.

Textured low-temperature epitaxial layer with SiO2 filling overcomes total internal reflection to boost light extraction efficiency.

Segmented ion implantation into layered silicon films maintains impurity concentration at the bottom of recessed-channel electrodes.

A scattering film with uneven shapes reduces micro cavity effects in light emitting displays.

Self-aligned memory decks reduce defects by merging mask operations across multiple layers.

Parallel conductive patterns reduce cathode resistance and eliminate IR drops, enabling narrower bezels and integrated fingerprint sensors.

Transfer printing organic layers onto convex bases reduces vacuum evaporation complexity while maintaining layer quality.

Annealing forms an oxide film on source and data lines to prevent corrosion by etching agents during pattern formation.

Identical polarizing members rotated to specific angles resolve pixel characteristic variations, improving polarization measurement precision.

A protector layer overlaps signal wire portions in flexible display bending areas to shield conductive elements from manufacturing etching processes.

Etched substrate strips balance unbalanced stress on isolated silicon regions, preserving device performance and structural integrity.

Auxiliary cathode segments reduce impedance to ensure uniform brightness across the display panel.

A multi-layered polymer lens uses non-planar cavity surfaces to control optical focusing through discrete layer composition.

Parallel electrostatic discharge protection element connects to integrated passive device filtering circuit capacitor.

A thermal oxidation process converts an upper epitaxial layer to oxide, enabling dual strained channels on one wafer.

A UV light-emitting device uses an intermediate layer with lower aluminum composition and segmented electrodes to improve current spreading.

Adjusting phosphor peak wavelengths and intensities reduces spectral irregularities, ensuring color tones match natural sunlight.

A cover panel integrates a partition layer, metal light blocking layer, and reflective layer to manage optical paths in quantum dot displays.

Segmenting the shallow trench isolation exposes sidewalls for epitaxial growth, reducing drain-induced barrier lowering and short channel effects.

A hybrid circuit device uses a hollow portion to thermally isolate the microcomputer from the power transistor.

A static electricity prevention capacitor diverts charges through integrated lower and upper patterns.

An enclosed coating system applies patterned organic films using slot die technology within an inert environment.

Spacing the resistance-reducing layer from the connection pad minimizes bezel area while preventing oxidation-induced resistance increase.

A direct patterning method using organic solvents to thin insulating layers and form bank structures for inkjet printing.

A cup-shaped heating electrode structure with phase change material spacers minimizes contact area for higher device density.

Interrupter layers with alternating doped regions confine eddy currents in semiconductor substrates.

Segmented buried vias bridge stacked dies without penetrating wafers, eliminating exclusion zones that block routing streets and power distribution.

Vertical electrode stacking with sidewall grooves increases memory cell density while reducing fabrication costs for semiconductor devices.

A planar light-collecting element uses concentric loops with varying refractive indices to focus incident light.

Metal-fluoride ionic compound pixel defining layers resolve the contradiction between manufacturing ease and overall device thickness in OLED displays.

A light attenuation layer on a split pixel cell desensitizes the small photodiode, preventing saturation and reducing LED flickering artifacts.

An oblique pick up plug creates a vertical conductive path for electron dissipation, reducing electric resistance in scaled-down p-type isolations.

A position detection sensor uses asymmetric pixel pair groups to calculate incident light coordinates via integrated electric signals.

Segmenting lower electrodes into a staggered grid allows slot die coating to pack more sub cells, raising voltage without expanding module area.

Segmented interface blocks with centralized logic hubs reduce clock tree length and jitter for high-density integrated circuits.

Segmented sputtering protects organic layers from damage while forming an impermeable metal barrier against oxygen and water.

A dummy capacitor design uses a larger area with restricted line width to match ferroelectric capacitor etching profiles.

A cap film sits between the control gate electrode and interlayer insulating films to block direct plug contact.

Penetration region sacrificial members reduce manufacturing costs and etching defects in three-dimensional stacked memory arrays.

An organic light-emitting display panel uses earth metal dopants to balance electron and hole mobility within functional layers.

Distinct microlens focal lengths resolve autofocusing inaccuracy caused by identical phase difference detection pixel optics.

A display substrate design routes touch electrode lines between spaced barrier structures to enhance wiring reliability.

Segmented emission layers with differential ligand mobility confine excitons to minimize quenching and enhance color purity.